SGUS034F February   2001  – June 2015 SMJ320VC33

PRODUCTION DATA.  

  1. Features
  2. Description
  3. Revision History
  4. Description (continued)
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Electrical Characteristics
    4. 6.4  Phase-Locked Loop Characteristics Using EXTCLK or On-Chip Crystal Oscillator Timing Requirements
    5. 6.5  Circuit Parameters for On-Chip Crystal Oscillator Timing Requirements
    6. 6.6  Timing Requirements for EXTCLK, All Modes
    7. 6.7  Timing Requirements for Memory Read/Write for STRB
    8. 6.8  Timing Requirements for XF0 and XF1 when Executing LDFI or LDII
    9. 6.9  Timing Requirements for XF0 and XF1 when Executing SIGI
    10. 6.10 Timing Requirements for Changing XFx from Output to Input Mode
    11. 6.11 Timing Requirements for RESET
    12. 6.12 Timing Requirements for INT3 to INT0 Response
    13. 6.13 Timing Requirements for Serial Port
    14. 6.14 Timing Requirements for HOLD/HOLDA
    15. 6.15 Timing Requirements for Peripheral Pin General-Purpose I/O
    16. 6.16 Timing Requirements for Timer Pin
    17. 6.17 Timing Requirements for IEEE-1149.1 Test Access Port
    18. 6.18 Switching Characteristics for EXTCLK, All Modes
    19. 6.19 Switching Characteristics for Memory Read/Write for STRB
    20. 6.20 Switching Characteristics for XF0 and XF1 when Executing LDFI or LDII
    21. 6.21 Switching Characteristics for XF0 when Executing STFI or STII
    22. 6.22 Switching Characteristics for XF0 and XF1 when Executing SIGI
    23. 6.23 Switching Characteristics for Loading when XF is Configured as an Output
    24. 6.24 Switching Characteristics for Changing XFx from Output to Input Mode
    25. 6.25 Switching Characteristics for Changing XFx from an Input to an Output
    26. 6.26 Switching Characteristics for RESET
    27. 6.27 Switching Characteristics for IACK
    28. 6.28 Switching Characteristics for Serial Port
    29. 6.29 Switching Characteristics for HOLD/HOLDA
    30. 6.30 Switching Characteristics for Peripheral Pin General-Purpose I/O
    31. 6.31 Switching Characteristics for Timer Pin
    32. 6.32 Switching Characteristics for SHZ
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1  JTAG Scan-Based Emulation Logic
      2. 8.2.2  Clock Generator
      3. 8.2.3  PLL and Clock Oscillator Control
      4. 8.2.4  PLL Isolation
      5. 8.2.5  Clock and PLL Considerations on Initialization
      6. 8.2.6  EDGEMODE
      7. 8.2.7  Reset Operation
      8. 8.2.8  PAGE0 to PAGE3 Select Lines
      9. 8.2.9  Using External Logic With the READY Pin
      10. 8.2.10 Posted Writes
      11. 8.2.11 Data Bus I/O Buffer
      12. 8.2.12 Bootloader Operation
      13. 8.2.13 JTAG Emulation
      14. 8.2.14 Designing a Target System Emulator Connector (14-Pin Header)
      15. 8.2.15 JTAG Emulator Cable Pod Logic
      16. 8.2.16 Reset Timing
      17. 8.2.17 Interrupt Response TIming
      18. 8.2.18 Interrupt-Acknowledge Timing
      19. 8.2.19 Data-Rate Timing Modes
      20. 8.2.20 HOLD Timing
      21. 8.2.21 General-Purpose I/O Timing
      22. 8.2.22 Peripheral Pin I/O Timing
      23. 8.2.23 Timer Pin Timing
    3. 8.3 Register Maps
  9. Power Supply Recommendations
    1. 9.1 Power Sequencing Considerations
  10. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Timing Parameter Symbology
      2. 10.2.2 Device and Development-Support Tool Nomenclature
    3. 10.3 Related Links
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
  • HFG|164
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.