ZHCSSS4 august   2023 REF35-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Temperature Coefficient
    3. 8.3 Long-Term Stability
    4. 8.4 Thermal Hysteresis
    5. 8.5 Noise Performance
      1. 8.5.1 Low-Frequency (1/f) Noise
      2. 8.5.2 Broadband Noise
    6. 8.6 Power Dissipation
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 EN Pin
      3. 9.3.3 NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Start-Up
      3. 9.4.3 Output Transient Behavior
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Negative Reference Voltage
    3. 10.3 Typical Application: Precision Power Supply and Reference
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
        1. 10.3.2.1 Selection of Reference
        2. 10.3.2.2 Input and Output Capacitors
        3. 10.3.2.3 Selection of ADC
      3. 10.3.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) REF35-Q1 UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 164.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 102.5 °C/W
RθJB Junction-to-board thermal resistance 59.6 °C/W
ΨJT Junction-to-top characterization parameter 44.0 °C/W
ΨJB Junction-to-board characterization parameter 59.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.