ZHCSI16F March   2002  – April 2018 OPA2357 , OPA357

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = +2.7-V to +5.5-V Single-Supply
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  OPAx357 Comparison
      2. 7.3.2  Operating Voltage
      3. 7.3.3  Enable Function
      4. 7.3.4  Rail-to-Rail Input
      5. 7.3.5  Rail-to-Rail Output
      6. 7.3.6  Output Drive
      7. 7.3.7  Video
      8. 7.3.8  Wideband Video Multiplexing
      9. 7.3.9  Driving Analog-to-Digital Converters
      10. 7.3.10 Capacitive Load and Stability
      11. 7.3.11 Wideband Transimpedance Amplifier
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 OPAx357 Design Procedure
            1. 8.2.1.2.2.1 Optimizing the Transimpedance Circuit
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High-Impedance Sensor Interface
      3. 8.2.3 Driving ADCs
      4. 8.2.4 Active Filter
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from E Revision (May 2009) to F Revision

  • Added 添加了器件信息 表、引脚功能 表、ESD 额定值 表、建议运行条件 表、热性能信息 表、概述 部分、功能块图 部分、特性 说明 部分，器件功能模式 部分，应用和实施 部分，电源相关建议 部分，布局 部分，器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Changed 在整篇文档中将MSOP 更改为 VSSOPGo
  • Deleted 在文档中删除了 DDA 封装 (SO-8 PowerPAD)Go
  • Changed 在整篇文档中将MSOP 更改为 VSSOPGo
  • Added WEBENCH 特性特性项目符号中添加了器件 HBM 和 CDM 分类子项目符号Go
  • Deleted OADI from DBV pin drawingGo
  • Deleted Package/Ordering Information tableGo
  • Deleted footnote from Signal input pins parameter in Absolute Maximum Ratings tableGo
  • Changed Temperature Range section of Electrical Characteristics table: changed θJA to RθJA and deleted Specified range, Operating range, and Storage range parametersGo
  • Added OPAx357 Comparison section and moved OPAx357 Related Products table to this section from page 1Go
  • Deleted first paragraph of Power Dissipation sectionGo
  • Changed PCB Layout title to Layout GuidelinesGo
  • Deleted PowerPAD Thermall Enhanced Package and PowerPAD Assembly Process sectionsGo
  • Added 添加了借助 WEBENCH® 工具定制设计方案 部分Go