SBOS483I July   2009  – May 2015 OPA2333-HT

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Voltage
      3. 7.3.3 Internal Offset Correction
      4. 7.3.4 Achieving Output Swing to the Operational Amplifier Negative Rail
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Precision, Low-Level Voltage-to-Current (V-I) Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Composite Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Temperature Measurement Application
      2. 8.3.2 Single Operational Amplifier Bridge Amplifier Application
      3. 8.3.3 Low-Side Current Monitor Application
      4. 8.3.4 Other Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General Layout Guidelines
      2. 10.1.2 DFN Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

D, JD, or HKJ Package
8-Pin SOIC, CDIP SB, or CFP
Top View
OPA2333-HT po_bos483_1.gif
HKQ Package
8-Pin CFP
Top View
OPA2333-HT hkq_po_bos483_1.gif
HKQ as formed or HKL mounted dead bug

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 OUT A O Analog output channel A
2 –IN A I Inverting analog input channel A
3 +IN A I Noninverting analog input channel A
5 +IN B I Noninverting analog input channel B
6 –IN B I Inverting analog input channel B
4 V– — Negative (lowest) power supply
7 OUT B O Analog output channel B
8 V+ — Positive (highest) power supply
OPA2333-HT die_bos483.gif

Table 1. Bare Die Information

DIE THICKNESS BACKSIDE FINISH BACKSIDE
POTENTIAL		 BOND PAD
METALLIZATION COMPOSITION
15 mils. Silicon with backgrind V- Al-Si-Cu (0.5%)

Table 2. Bond Pad Coordinates

DESCRIPTION PAD NUMBER A B C D
OUT A 1 21.20 1288.50 97.20 1364.50
–IN A 2 21.20 923.65 97.20 999.65
+IN A 3 21.20 533.05 97.20 609.05
V– 4 31.30 172.20 107.30 248.20
+IN B 5 864.80 162.25 940.80 238.25
–IN B 6 864.80 552.65 940.80 628.65
OUT B 7 864.80 897.10 940.80 973.10
V+ 8 854.70 1280.45 930.70 1356.45