ZHCSWX9C January   1995  – August 2024 OPA132 , OPA2132 , OPA4132

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA132
    5. 5.5 Thermal Information - OPA2132
    6. 5.6 Thermal Information - OPA4132
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Voltage
      2. 7.1.2 Offset Voltage Trim
      3. 7.1.3 Input Bias Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Analog Filter Designer
        2. 8.1.1.2 TINA-TI™ 仿真软件（免费下载）
        3. 8.1.1.3 TI 参考设计
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

5.4 Thermal Information - OPA132

THERMAL METRIC(1) OPA132 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance  160 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75 °C/W
RθJB Junction-to-board thermal resistance 60 °C/W
ΨJT Junction-to-top characterization parameter 9 °C/W
ΨJB Junction-to-board characterization parameter 50 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.