ZHCSDW6A June   2015  – July 2015 ONET1130EP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Pin Configuration and Function
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 Transmitter AC Electrical Characteristics
    7. 7.7 Receiver AC Electrical Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmitter
        1. 8.3.1.1 Equalizer
        2. 8.3.1.2 Modulator Driver
        3. 8.3.1.3 Modulation Current Generator
        4. 8.3.1.4 DC Offset Cancellation and Cross Point Control
        5. 8.3.1.5 Transmitter Loopback (Electrical Loopback)
        6. 8.3.1.6 Bias Current Generation and APC Loop
        7. 8.3.1.7 Laser Safety Features and Fault Recovery Procedure
      2. 8.3.2 Receiver
        1. 8.3.2.1 Equalizer
        2. 8.3.2.2 DC Offset Cancellation and Cross Point Control
        3. 8.3.2.3 Output Driver
        4. 8.3.2.4 Receiver Loopback (Optical Loopback)
        5. 8.3.2.5 Loss of Signal Detection
      3. 8.3.3 Analog Block
        1. 8.3.3.1 Analog Reference and Temperature Sensor
        2. 8.3.3.2 Power-On Reset
        3. 8.3.3.3 Analog to Digital Converter
        4. 8.3.3.4 2-Wire Interface and Control Logic
        5. 8.3.3.5 Bus Idle
        6. 8.3.3.6 Start Data Transfer
        7. 8.3.3.7 Stop Data Transfer
        8. 8.3.3.8 Data Transfer
      4. 8.3.4 Acknowledge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Differential Transmitter Output
      2. 8.4.2 Single-Ended Transmitter Output
    5. 8.5 Programming
    6. 8.6 Register Mapping
      1. 8.6.1 R/W Control Registers
        1. 8.6.1.1 Core Level Register 0 (offset = 0100 0001 [reset = 41h]
        2. 8.6.1.2 Core Level Register 1 (offset = 0000 0000) [reset = 0h]
        3. 8.6.1.3 Core Level Register 2 (offset = 0000 0000 ) [reset = 0h]
        4. 8.6.1.4 Core Level Register 3 (offset = 0000 0000) [reset = 0h]
      2. 8.6.2 RX Registers
        1. 8.6.2.1 RX Register 4 (offset = 0000 0000) [reset = 0h]
        2. 8.6.2.2 RX Register 5 (offset = 0000 0000) [reset = 0h]
        3. 8.6.2.3 RX Register 6 (offset = 0000 0000) [reset = 0h]
        4. 8.6.2.4 RX Register 7 (offset = 0000 0000) [reset = 0h]
        5. 8.6.2.5 RX Register 8 (offset = 0000 0000) [reset = 0h]
        6. 8.6.2.6 RX Register 9 (offset = 0000 0000) [reset = 0h]
      3. 8.6.3 TX Registers
        1. 8.6.3.1 TX Register 10 (offset = 0000 0000) [reset = 0h]
        2. 8.6.3.2 TX Register 11 (offset = 0000 0000) [reset = 0h]
        3. 8.6.3.3 TX Register 12 (offset = 0000 0000) [reset = 0h]
        4. 8.6.3.4 TX Register 13 (offset = 0h) [reset = 0]
        5. 8.6.3.5 TX Register 14 (offset = 0000 0000) [reset = 0h]
        6. 8.6.3.6 TX Register 15 (offset = 0000 0000) [reset = 0h]
        7. 8.6.3.7 TX Register 16 (offset = 0000 0000) [reset = 0h]
        8. 8.6.3.8 TX Register 17 (offset = 0000 0000) [reset = 0h]
        9. 8.6.3.9 TX Register 18 (offset = 0000 0000) [reset = 0h]
      4. 8.6.4 Reserved Registers
        1. 8.6.4.1 Reserved Registers19-39
      5. 8.6.5 Read Only Registers
        1. 8.6.5.1 Core Level Register 40 (offset = 0000 0000) [reset = 0h]
        2. 8.6.5.2 Core Level Register 41 (offset = 0000 0000) [reset = 0h]
        3. 8.6.5.3 RX Registers 42 (offset = 0000 0000) [reset = 0h]
        4. 8.6.5.4 TX Register 43 (offset = 0000 0000) [reset = 0h]
      6. 8.6.6 Adjustment Registers
        1. 8.6.6.1 Adjustment Registers 44-55
        2. 8.6.6.2 Adjustment Registers 52-55
  9. 9 Application Information and Implementations
    1. 9.1 Application Information
    2. 9.2 Typical Application, Transmitter Differential Mode
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 Typical Application, Transmitter Single-Ended Mode
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.