ZHCSCI4E May   2014  – August 2018 MSP430FR5847 , MSP430FR58471 , MSP430FR5848 , MSP430FR5849 , MSP430FR5857 , MSP430FR5858 , MSP430FR5859 , MSP430FR5867 , MSP430FR58671 , MSP430FR5868 , MSP430FR5869

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics – Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode (LPM3.5, LPM4.5) Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 5.10 Typical Characteristics, Current Consumption per Module
    11. 5.11 Thermal Resistance Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.12.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.12.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.12.4  Wake-up Characteristics
        1. Table 5-9  Wake-up Times From Low-Power Modes and Reset
        2. Table 5-10 Typical Wake-up Charge
        3. 5.12.4.1   Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 5.12.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.12.5.1   Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 5-13 Pin-Oscillator Frequency, Ports Px
        5. 5.12.5.2   Typical Characteristics, Pin-Oscillator Frequency
      6. 5.12.6  Timer_A and Timer_B
        1. Table 5-14 Timer_A
        2. Table 5-15 Timer_B
      7. 5.12.7  eUSCI
        1. Table 5-16 eUSCI (UART Mode) Clock Frequency
        2. Table 5-17 eUSCI (UART Mode)
        3. Table 5-18 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-19 eUSCI (SPI Master Mode)
        5. Table 5-20 eUSCI (SPI Slave Mode)
        6. Table 5-21 eUSCI (I2C Mode)
      8. 5.12.8  ADC
        1. Table 5-22 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-23 12-Bit ADC, Timing Parameters
        3. Table 5-24 12-Bit ADC, Linearity Parameters With External Reference
        4. Table 5-25 12-Bit ADC, Dynamic Performance for Differential Inputs With External Reference
        5. Table 5-26 12-Bit ADC, Dynamic Performance for Differential Inputs With Internal Reference
        6. Table 5-27 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With External Reference
        7. Table 5-28 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With Internal Reference
        8. Table 5-29 12-Bit ADC, Dynamic Performance With 32.768-kHz Clock
        9. Table 5-30 12-Bit ADC, Temperature Sensor and Built-In V1/2
        10. Table 5-31 12-Bit ADC, External Reference
      9. 5.12.9  Reference
        1. Table 5-32 REF, Built-In Reference
      10. 5.12.10 Comparator
        1. Table 5-33 Comparator_E
      11. 5.12.11 FRAM
        1. Table 5-34 FRAM
    13. 5.13 Emulation and Debug
      1. Table 5-35 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
      1. 6.3.1 Peripherals in Low-Power Modes
        1. 6.3.1.1 Idle Currents of Peripherals in LPM3 and LPM4
    4. 6.4  Interrupt Vector Table and Signatures
    5. 6.5  Memory Organization
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  FRAM
    9. 6.9  Memory Protection Unit Including IP Encapsulation
    10. 6.10 Peripherals
      1. 6.10.1  Digital I/O
      2. 6.10.2  Oscillator and Clock System (CS)
      3. 6.10.3  Power-Management Module (PMM)
      4. 6.10.4  Hardware Multiplier (MPY)
      5. 6.10.5  Real-Time Clock (RTC_B) (Only MSP430FR586x and MSP430FR584x)
      6. 6.10.6  Watchdog Timer (WDT_A)
      7. 6.10.7  System Module (SYS)
      8. 6.10.8  DMA Controller
      9. 6.10.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.10.10 TA0, TA1
      11. 6.10.11 TA2, TA3
      12. 6.10.12 TB0
      13. 6.10.13 ADC12_B
      14. 6.10.14 Comparator_E
      15. 6.10.15 CRC16
      16. 6.10.16 True Random Seed
      17. 6.10.17 Shared Reference (REF)
      18. 6.10.18 Embedded Emulation
        1. 6.10.18.1 Embedded Emulation Module (EEM)
        2. 6.10.18.2 EnergyTrace++ Technology
      19. 6.10.19 Peripheral File Map
    11. 6.11 Input/Output Diagrams
      1. 6.11.1  Capacitive Touch Functionality Ports P1, P2, P3, P4, and PJ
      2. 6.11.2  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      3. 6.11.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.11.4  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      5. 6.11.5  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      6. 6.11.6  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      7. 6.11.7  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      8. 6.11.8  Port P2 (P2.7) Input/Output With Schmitt Trigger
      9. 6.11.9  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      10. 6.11.10 Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
      11. 6.11.11 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
      12. 6.11.12 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
      13. 6.11.13 Port PJ, PJ.4 and PJ.5 Input/Output With Schmitt Trigger
      14. 6.11.14 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
      15. 6.11.15 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptor (TLV)
    13. 6.13 Identification
      1. 6.13.1 Revision Identification
      2. 6.13.2 Device Identification
      3. 6.13.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1  入门和后续步骤
    2. 8.2  器件命名规则
    3. 8.3  工具和软件
    4. 8.4  文档支持
    5. 8.5  相关链接
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.12 Device Descriptor (TLV)

Table 6-62 lists the Device IDs of the MSP430FR58xx(1) devices. Table 6-63 lists the contents of the device descriptor tag-length-value (TLV) structure for MSP430FR58xx(1) devices without AES.

Table 6-62 Device IDs

DEVICE DEVICE ID
01A05h 01A04h
MSP430FR5869 081h 05Dh
MSP430FR5868 081h 05Ch
MSP430FR5867(1) 081h 05Bh
MSP430FR5849 081h 055h
MSP430FR5848 081h 054h
MSP430FR5847(1) 081h 053h
MSP430FR5859 081h 059h
MSP430FR5858 081h 058h
MSP430FR5857 081h 057h

Table 6-63 Device Descriptor(1)

DESCRIPTION MSP430FR58xx (UART BSL) MSP430FR58xx(1) (I2C BSL)
ADDRESS VALUE ADDRESS VALUE
Info Block Info length 01A00h 06h 01A00h 06h
CRC length 01A01h 06h 01A01h 06h
CRC value 01A02h Per unit 01A02h Per unit
01A03h Per unit 01A03h Per unit
Device ID 01A04h see Table 6-62 01A04h see Table 6-62
Device ID 01A05h
Hardware revision 01A06h Per unit 01A06h Per unit
Firmware revision 01A07h Per unit 01A07h Per unit
Die Record Die record tag 01A08h 08h 01A08h 08h
Die record length 01A09h 0Ah 01A09h 0Ah
Lot/wafer ID 01A0Ah Per unit 01A0Ah Per unit
01A0Bh Per unit 01A0Bh Per unit
01A0Ch Per unit 01A0Ch Per unit
01A0Dh Per unit 01A0Dh Per unit
Die X position 01A0Eh Per unit 01A0Eh Per unit
01A0Fh Per unit 01A0Fh Per unit
Die Y position 01A10h Per unit 01A10h Per unit
01A11h Per unit 01A11h Per unit
Test results 01A12h Per unit 01A12h Per unit
01A13h Per unit 01A13h Per unit
ADC12 Calibration ADC12 calibration tag 01A14h 11h 01A14h 11h
ADC12 calibration length 01A15h 10h 01A15h 10h
ADC gain factor(2) 01A16h Per unit 01A16h Per unit
01A17h Per unit 01A17h Per unit
ADC offset(3) 01A18h Per unit 01A18h Per unit
01A19h Per unit 01A19h Per unit
ADC 1.2-V reference
Temperature sensor 30°C		 01A1Ah Per unit 01A1Ah Per unit
01A1Bh Per unit 01A1Bh Per unit
ADC 1.2-V reference
Temperature sensor 85°C		 01A1Ch Per unit 01A1Ch Per unit
01A1Dh Per unit 01A1Dh Per unit
ADC 2.0-V reference
Temperature sensor 30°C		 01A1Eh Per unit 01A1Eh Per unit
01A1Fh Per unit 01A1Fh Per unit
ADC 2.0-V reference
Temperature sensor 85°C		 01A20h Per unit 01A20h Per unit
01A21h Per unit 01A21h Per unit
ADC 2.5-V reference
Temperature sensor 30°C		 01A22h Per unit 01A22h Per unit
01A23h Per unit 01A23h Per unit
ADC 2.5-V reference
Temperature sensor 85°C		 01A24h Per unit 01A24h Per unit
01A25h Per unit 01A25h Per unit
REF Calibration REF calibration tag 01A26h 12h 01A26h 12h
REF calibration length 01A27h 06h 01A27h 06h
REF 1.2-V reference 01A28h Per unit 01A28h Per unit
01A29h Per unit 01A29h Per unit
REF 2.0-V reference 01A2Ah Per unit 01A2Ah Per unit
01A2Bh Per unit 01A2Bh Per unit
REF 2.5-V reference 01A2Ch Per unit 01A2Ch Per unit
01A2Dh Per unit 01A2Dh Per unit
Random Number 128-bit random number tag 01A2Eh 15h 01A2Eh 15h
Random number length 01A2Fh 10h 01A2Fh 10h
128-bit random number(4) 01A30h Per unit 01A30h Per unit
01A31h Per unit 01A31h Per unit
01A32h Per unit 01A32h Per unit
01A33h Per unit 01A33h Per unit
01A34h Per unit 01A34h Per unit
01A35h Per unit 01A35h Per unit
01A36h Per unit 01A36h Per unit
01A37h Per unit 01A37h Per unit
01A38h Per unit 01A38h Per unit
01A39h Per unit 01A39h Per unit
01A3Ah Per unit 01A3Ah Per unit
01A3Bh Per unit 01A3Bh Per unit
01A3Ch Per unit 01A3Ch Per unit
01A3Dh Per unit 01A3Dh Per unit
01A3Eh Per unit 01A3Eh Per unit
01A3Fh Per unit 01A3Fh Per unit
BSL Configuration BSL tag 01A40h 1Ch 01A40h 1Ch
BSL length 01A41h 02h 01A41h 02h
BSL interface 01A42h 00h 01A42h 01h
BSL interface configuration 01A43h 00h 01A43h 48h
(1) NA = Not applicable, Per unit = content can differ from device to device
(2) ADC gain: the gain correction factor is measured at room temperature using a 2.5-V external voltage reference without internal buffer (ADC12VRSEL=0x2, 0x4, or 0xE). Other settings (for example, using internal reference) can result in different correction factors.
(3) ADC offset: the offset correction factor is measured at room temperature using ADC12VRSEL= 0x2 or 0x4, an external reference, VR+ = external 2.5 V, VR- = AVSS.
(4) 128-bit random number: The random number is generated during production test using the CryptGenRandom() function from Microsoft®.