5 Revision History

Changes from December 9, 2015 to September 17, 2018

• Added Section 6.1, Related Products Go
• Added typical conditions statements at the beginning of Section 8, Specifications Go
• Changed the MIN value of the V_{(DVCC_BOR_hys)} parameter from 60 mV to 50 mV in Section 8.21, PMM, Brownout Reset (BOR) Go
• Updated notes (1) and (2) and added note (3) in Section 8.27, Wake-up Times From Low-Power Modes and Reset Go
• Removed ADC12DIV from the formula for the TYP value in the second row of the t_CONVERT parameter in Section 8.38, 12-Bit ADC, Timing Parameters, because ADC12CLK is after divisionGo
• Removed the note that started "This impedance depends on..." from the "Reference input resistance" parameter in Section 8.48, 12-Bit DAC, Reference Input Specifications Go
• Added second row for t_{EN_CMP} with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µs in Section 8.51, Comparator_B Go
• Renamed FCTL4.MGR0 and MGR1 in the f_MCLK,MGR parameter in Section 8.57, Flash Memory to be consistent with header files Go
• Replaced former section Development Tools Support with Section 10.3, Tools and Software Go

Changes from August 6, 2013 to December 8, 2015

• 通篇更改了格式和结构，包括添加了章节编号Go
• 已将全部功能框图移动至Section 4，功能框图 Go
• Added USB column to Table 6-1, Family Members Go
• Added Section 6, Device Comparison, and moved Table 6-1 to itGo
• Added "Port U is supplied by the LDOO rail" to the PU.0 and PU.1 descriptions in Section 7.2, Signal Descriptions Go
• Added Section 8.2, ESD Ratings Go
• Added note to C_VCORE Go
• Added note to R_Pull Go
• Changed TYP value of C_L,eff with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pFGo
• In V_BAT3 parameter description, changed from "V_BAT3 ≠ V_BAT/3" to "V_BAT3 = V_BAT/3"Go
• Changed from f_{DAC12_0OUT} to f_{DAC12_1OUT} in the first row of the Test Conditions for the "Channel-to-channel crosstalk" parameterGo
• Changed the value of DAC12_xDAT from 7F7h to F7Fh and changed the x-axis label from f_Toggle to 1/f_Toggle in Figure 8-22, Crosstalk Test Conditions Go
• Added note to R_PUR Go
• Corrected the spelling of the MRG bits in the f_MCLK,MRG parameter in Section 8.57, Flash Memory Go
• Removed RTC_B from LPM4.5 wake-up optionsGo
• Throughout document, changed all instances of "bootstrap loader" to "bootloader" Go
• Added the paragraph that starts "Using the MSP430 RTC_B Module With Battery Backup Supply describes how..." Go
• Corrected names of interrupt events PMMSWBOR (BOR) and PMMSWPOR (POR) in Table 9-11, System Module Interrupt Vector Registers Go
• Corrected spelling of NMIIFG (added missing "I") in Table 9-11, System Module Interrupt Vector Registers Go
• Corrected register acronyms (added "USB" prefix as required) in Table 9-50, USB Control Registers Go
• Added connection from "LCDS40...LCDS42" to AND gate in Figure 9-7, Port P5 (P5.2 to P5.7) Diagram Go
• Added P7SEL.2 and XT2BYPASS inputs with AND and OR gates in Figure 9-10, Port P7 (P7.3) Diagram Go
• Changed P7SEL.3 column from X to 0 for "P7.3 (I/O)" rowsGo
• Added Section 10 and moved Development Tools Support, Device and Development Tool Nomenclature, Trademarks, and Electrostatic Discharge Caution sections to itGo
• Added Section 11, Mechanical, Packaging, and Orderable Information Go

Changes from Revision () to Revision ()