ZHCSTI7D June   1980  – October 2023 MC3486

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Resistance Characteristics
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 商标
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NS|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Resistance Characteristics

THERMAL METRIC(1)D (SOIC)N (PDIP)NS (SOP)UNIT
16-PINS
R θJAJunction-to-ambient thermal resistance 84.660.688.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.548.146.2°C/W
R θJBJunction-to-board thermal resistance 43.240.650.7°C/W
ψ JTJunction-to-top characterization parameter 10.427.513.5°C/W
ψ JBJunction-to-board characterization parameter 42.840.350.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance n/an/an/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.