ZHCSKP5D june   2020  – april 2023 LMV321A-Q1 , LMV324A-Q1 , LMV358A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321A-Q1
    5. 6.5 Thermal Information: LMV358A-Q1
    6. 6.6 Thermal Information: LMV324A-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Common Mode Range
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LMV3xxA-Q1 Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Supply Photodiode Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Input and ESD Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (January 2023) to Revision D (April 2023)

  • 将 DBV 封装状态从预发布 更改为正在供货 Go

Changes from Revision B (October 2021) to Revision C (January 2023)

  • 删除了器件信息 表中 SC70 (5) 封装的预发布说明Go
  • Changed the formatting of the Pin Configuration and Functions sectionGo
  • Changed values in Thermal Information: LMV321A-Q1 tableGo

Changes from Revision A (April 2021) to Revision B (October 2021)

  • 在数据表添加了 LMV321A-Q1 GPNGo
  • 在器件信息 表中添加了 SOT-23 (5) 和 SC70 (5) 封装Go
  • 删除了器件信息 表中 SOT-23 (14) 和 TSSOP (14) 封装的预发布说明Go
  • Added LMV321A-Q1 SOT-23 (5), SC70 (5), and LMV321AU-Q1 SOT-23 (5) Packages, to Pin Configuration and Functions sectionGo
  • Added Thermal Information: LMV321A-Q1 tableGo

Changes from Revision * (June 2020) to Revision A (April 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 删除了器件信息 表中 VSSOP (8) 封装的预览说明Go
  • 删除了器件信息 表中的 SOT-23 (8)、TSSOP (8)、SOT-23 (5) 和 SC70 (5) 封装Go
  • Deleted TSSOP (8) Package, from Pin Configuration and Functions sectionGo
  • Added note (4) to differential input voltage in Absolute Maximum Ratings tableGo
  • Added thermal information for DGK packageGo
  • Added thermal information for DYY packageGo