ZHCSEB9A October   2015  – November 2015 LMK61PD0A2

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Control
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - Power Supply
    6. 7.6  LVPECL Output Characteristics
    7. 7.7  LVDS Output Characteristics
    8. 7.8  HCSL Output Characteristics
    9. 7.9  OE Input Characteristics
    10. 7.10 OS, FS[1:0] Input Characteristics
    11. 7.11 Frequency Tolerance Characteristics
    12. 7.12 Power-On/Reset Characteristics (VDD)
    13. 7.13 PSRR Characteristics
    14. 7.14 PLL Clock Output Jitter Characteristics
    15. 7.15 Additional Reliability and Qualification
    16. 7.16 Typical Performance Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Block-Level Description
      2. 9.3.2 Device Configuration Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Jitter Considerations in Serdes Systems
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ensuring Thermal Reliability
      2. 12.1.2 Best Practices for Signal Integrity
      3. 12.1.3 Recommended Solder Reflow Profile
  13. 13器件和文档支持
    1. 13.1 社区资源
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。