ZHCSP67A October   2021  – January 2022 LMK1D2106 , LMK1D2108

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 LVDS Output Termination
      2. 8.4.2 Input Termination
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) LMK1D2106 LMK1D2108 UNIT
RHA (VQFN) RGZ (VQFN)
40 PINS 48 PINS
RθJA Junction-to-ambient thermal resistance 30.3 30.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.6 21.2 °C/W
RθJB Junction-to-board thermal resistance 13.1 12.9 °C/W
ΨJT Junction-to-top characterization parameter 0.4 0.4 °C/W
ΨJB Junction-to-board characterization parameter 13 12.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.5 4.5 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.