ZHCSW86F July   2005  – August 2024 LMH6702QML-SP

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Quality Conformance Inspection
    4. 5.4 Electrical Characteristics: DC Parameters
    5. 5.5 Electrical Characteristics: AC Parameters
    6. 5.6 Electrical Characteristics: Drift Values Parameters
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Feedback Resistor
      2. 6.1.2 Harmonic Distortion
      3. 6.1.3 Capacitive Load Drive
      4. 6.1.4 DC Accuracy and Noise
    2. 6.2 Layout
      1. 6.2.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3. 7.3 Trademarks
    4. 7.4 静电放电警告
    5. 7.5 术语表
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision E (March 2013) to Revision F (August 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Changed input bias current noninverting limits from ±0.3μA to ±0.75μA for NAC package type in LMH6702 Electrical Characteristics Drift Values Parameters Go
  • Changed input offset voltage limits from ±0.3mA to ±1mV for NAC package type in LMH6702 Electrical Characteristics Drift Values Parameters Go

Changes from Revision D (October 2011) to Revision E (March 2013)

  • 将美国国家半导体数据表的布局更改为 TI 格式Go