ZHCSCR0A August   2014  – December 2014 LMH3401

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = 5 V
    6. 7.6 Electrical Characteristics: VS = 3.3 V
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  Output Reference Points
    2. 8.2  ATE Testing and DC Measurements
    3. 8.3  Frequency Response
    4. 8.4  S-Parameters
    5. 8.5  Frequency Response with Capacitive Load
    6. 8.6  Distortion
    7. 8.7  Noise Figure
    8. 8.8  Pulse Response, Slew Rate, Overdrive Recovery
    9. 8.9  Power Down
    10. 8.10 VCM Frequency Response
    11. 8.11 Test Schematics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully-Differential Amplifier
      2. 9.3.2 Single-Ended to Differential Signals
        1. 9.3.2.1 Resistor Design Equations for Single-to-Differential Applications
        2. 9.3.2.2 Input Impedance Calculations
      3. 9.3.3 Differential to Differential Signals
      4. 9.3.4 Output Common-Mode Voltage
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with a Split Supply
      2. 9.4.2 Operation with a Single Supply
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input and Output Headroom Considerations
      2. 10.1.2 Noise Analysis
      3. 10.1.3 Thermal Considerations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Driving Matched Loads
        2. 10.2.2.2 Driving Capacitive Loads
        3. 10.2.2.3 Driving ADCs
          1. 10.2.2.3.1 SNR Considerations
          2. 10.2.2.3.2 SFDR Considerations
          3. 10.2.2.3.3 ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.3.4 ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
        4. 10.2.2.4 GSPS ADC Driver
        5. 10.2.2.5 Common-Mode Voltage Correction
        6. 10.2.2.6 Active Balun
        7. 10.2.2.7 Application Curves
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power-Supply Recommendations
    1. 11.1 Supply Voltage
    2. 11.2 Single Supply
    3. 11.3 Split Supply
    4. 11.4 Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 器件命名规则
    2. 13.2 文档支持
      1. 13.2.1 相关文档　
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 器件支持

13.1.1 器件命名规则

device_markings_bos695.gifFigure 73. 器件标识信息

13.2 文档支持

13.2.1 相关文档　

相关文档如下：

  • 《THS4541 数据表》，SLOS375
  • 《ADS12D1800RF 数据表》，SNAS518
  • 《ADS5424 数据表》，SLWS157
  • 《ADS5485 数据表》，SLAS610
  • 《ADS6149 数据表》，SLWS211
  • 《ADS4149 数据表》，SBAS483
  • 《LMH3401EVM 评估模块》，SBOU124
  • 《AN-2188 在放大器和 ADC 之间：管理通信系统中的滤波器损耗》，SNOA567
  • 《AN-2235 LMH6517/21/22 和其它高速 IF/RF 反馈放大器的电路板设计》，SNOA869

13.3 商标

Marki is a trademark of Marki Microwave, Inc.

Rohde & Schwarz is a registered trademark of Rohde & Schwarz.

All other trademarks are the property of their respective owners.

13.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

13.5 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。