ZHCSKE0B March   2017  – October 2019 LMH1208

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Pins and Thresholds
      2. 7.3.2 OUT0_SEL and SDI_OUT2_SEL Control
      3. 7.3.3 Input Signal Detect
      4. 7.3.4 Continuous Time Linear Equalizer (CTLE)
      5. 7.3.5 Output Driver Control
        1. 7.3.5.1 Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
          1. 7.3.5.1.1 Output Amplitude (VOD)
          2. 7.3.5.1.2 Output Pre-Emphasis
          3. 7.3.5.1.3 Output Slew Rate
          4. 7.3.5.1.4 Output Polarity Inversion
        2. 7.3.5.2 Host-Side 100-Ω Output Driver (OUT0±)
      6. 7.3.6 Status Indicators and Interrupts
        1. 7.3.6.1 SD_N (Signal Detect)
        2. 7.3.6.2 INT_N (Interrupt)
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transaction
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
        2. 7.4.2.2 SPI Write Transaction Format
        3. 7.4.2.3 SPI Read Transaction Format
        4. 7.4.2.4 SPI Daisy Chain
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SMPTE Requirements and Specifications
      2. 8.1.2 LMH1208 and LMH1228 Compatibility
    2. 8.2 Typical Applications
      1. 8.2.1 Dual Cable Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Distribution Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Stack-Up and Ground References
      2. 10.1.2 High-Speed PCB Trace Routing and Coupling
      3. 10.1.3 Anti-Pads
      4. 10.1.4 BNC Connector Layout and Routing
      5. 10.1.5 Power Supply and Ground Connections
      6. 10.1.6 Footprint Recommendations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 出口管制提示
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5 Register Maps

The LMH1208 register map is divided into three register pages. These register pages are used to control different aspects of the LMH1208 functionality. A brief summary of the pages is shown below:

  1. Share Register Page: This page corresponds to global parameters, such as LMH1208 device ID and SD_N status configuration. This is the default page at start-up. Access this page by setting Reg 0xFF[2:0] = 000’b.
  2. CTLE Register Page: This page corresponds to IN0 PCB CTLE, output mux settings, and output interrupt overrides. Access this page by setting Reg 0xFF[2:0] = 100’b.
  3. Driver Register Page: This page corresponds to OUT0, SDI_OUT1, and SDI_OUT2 driver output settings. Access this page by setting Reg 0xFF[2:0] = 101’b.

For the complete register map, typical device configurations, and proper register reset sequencing, refer to the LMH1228 and LMH1208 Programming Guide (SNAU206).