ZHCSAK2H April   2007  – June 2016 LMH0302

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - DC
    6. 6.6 Electrical Characteristics - AC
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Interfacing
      2. 7.3.2 Output Interfacing
      3. 7.3.3 Output Slew Rate Control
      4. 7.3.4 Output Enable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for All Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage –0.5 3.6 V
Input voltage (all inputs) –0.3 VCC + 0.3 V
Output current 28 mA
Lead temperature, soldering (4 s) 260 °C
Junction temperature, TJ 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
Machine model (MM) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage (VCC – VEE) 3.13 3.3 3.46 V
Operating junction temperature 100 °C
Operating free air temperature, TA –40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1) LMH0302 UNIT
RUM (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 47.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.2 °C/W
RθJB Junction-to-board thermal resistance 25.6 °C/W
ψJT Junction-to-top characterization parameter 1.7 °C/W
ψJB Junction-to-board characterization parameter 25.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 14.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics – DC

Over supply voltage and operating free-air temperature range (unless otherwise noted) (1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCMIN Input common mode voltage SDI, SDI 1.1 + VSDI/2 VCC – VSDI/2 V
VSDI Input voltage swing Differential, SDI, SDI 100 2200 mVP−P
VCMOUT Output common mode voltage SDO, SDO VCC – VSDO V
VSDO Output voltage swing Single-ended, 75-Ω load,
RREF = 750 Ω 1%		 720 800 880 mVP−P
VIH Input voltage high level SD/HD, ENABLE 2 V
VIL Input voltage low level SD/HD, ENABLE 0.8 V
ICC Supply current SD/HD = 0, SDO/SDO enabled 50 59 mA
SD/HD = 0, SDO/SDO disabled 26 33
SD/HD = 1, SDO/SDO enabled 38 48
SD/HD = 1, SDO/SDO disabled 15 22
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 V.
(2) Typical values are stated for VCC = 3.3 V and TA = 25°C.

6.6 Electrical Characteristics – AC

Over supply voltage and operating free-air temperature range (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DRSDI Input data rate SDI, SDI 2970 Mbps
Tjit Additive jitter 2.97 Gbps, SDO, SDO 20 psP-P
1.485 Gbps, SDO, SDO 18
270 Mbps, SDO, SDO 15
tr,tf Output rise time, fall time SD/HD = 0, 20% – 80%, SDO, SDO 90 130 ps
SD/HD = 1, 20% – 80%, SDO, SDO 400 800
TMATCH Mismatch in rise time, fall time SD/HD = 0, SDO, SDO 30 ps
SD/HD = 1, SDO, SDO 50
TDCD Duty cycle distortion SD/HD = 0, 2.97 Gbps, SDO, SDO(2) 27 ps
SD/HD = 0, 1.485 Gbps, SDO, SDO(2) 30
SD/HD = 1, SDO, SDO(2) 100
TOS Output overshoot SD/HD = 0, SDO, SDO(2) 10%
SD/HD = 1, SDO, SDO(2) 8%
RLSDO Output return loss 5 MHz to 1.5 GHz, SDO, SDO(3) 15 dB
1.5 GHz to 3.0 GHz, SDO, SDO(3) 10
(1) Typical values are stated for VCC = 3.3 V and TA = 25°C.
(2) Specification is ensured by characterization.
(3) Output return loss is dependent on board design. The LMH0302 meets this specification on the SD302 evaluation board.

6.7 Typical Characteristics

Typical device characteristics at TA = 25°C and VCC = 3.3 V (unless otherwise noted)
LMH0302 lmh0302_3g_sdo.gif Figure 1. SDO PRBS10 at 2.97 Gbps
LMH0302 lmh0302_hd_sdo.gif Figure 2. SDO PRBS10 at 1.485 Gbps