SNVS754M January   2000  – February 2026 LM78L

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics: LM78L33 (New Chip Only)
    6. 5.6  Electrical Characteristics: LM78L05 (Legacy and New Chip)
    7. 5.7  Electrical Characteristics: LM78L06 (New Chip Only)
    8. 5.8  Electrical Characteristics: LM78L09 (Legacy Chip Only)
    9. 5.9  Electrical Characteristics: LM78L12 (Legacy and New Chip)
    10. 5.10 Electrical Characteristics: LM78L15 (Legacy and New Chip)
    11. 5.11 Electrical Characteristics: LM78L62 (Legacy Chip Only)
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Load Regulation
      2. 6.3.2 Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitor
        2. 7.2.2.2 Output Capacitor
        3. 7.2.2.3 Power Dissipation (PD)
        4. 7.2.2.4 Estimating Junction Temperature
        5. 7.2.2.5 Overload Recovery
        6. 7.2.2.6 Reverse Current
        7. 7.2.2.7 Polarity Reversal Protection
      3. 7.2.3 Application Curve
      4. 7.2.4 Other Application Circuits
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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6.4 Device Functional Modes

Device Functional Mode Comparison provides a comparison between the normal and dropout modes of operation. Note that if the device junction temperature becomes too high, thermal shutdown disables the device until the device has sufficiently cooled, regardless of VIN and IO conditions.

Table 6-1 Device Functional Mode Comparison
OPERATING MODE PARAMETER
VIN IO
NormalVIN > VIN(MIN)IO < IPK
DropoutVIN < VIN(MIN)IO < IPK