ZHCSDV6E May   2009  – July 2015 LM57

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics - Accuracy Characteristics - Trip Point Accuracy
    6. 7.6 Electrical Characteristics - Accuracy Characteristics - VTEMP Analog Temperature Sensor Output Accuracy
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LM57 VTEMP Temperature-to-Voltage Transfer Function
        1. 8.3.1.1 LM57 VTEMP Voltage-to-Temperature Equations
      2. 8.3.2 RSENSE
      3. 8.3.3 Resistor Selection
      4. 8.3.4 TOVER and TOVER Digital Outputs
        1. 8.3.4.1 TOVER and TOVER Noise Immunity
      5. 8.3.5 Trip Test Digital Input
      6. 8.3.6 VTEMP Analog Temperature Sensor Output
        1. 8.3.6.1 VTEMP Noise Considerations
        2. 8.3.6.2 VTEMP Capacitive Loads
        3. 8.3.6.3 VTEMP Voltage Shift
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 ADC Input Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selection of RSENSE Resistors
      3. 9.2.3 Application Curves
      4. 9.2.4 Grounding of the TRIP TEST Pin
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Temperature Considerations
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (February 2013) to E Revision

  • 已添加引脚配置和功能部分，ESD 额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • 已在整篇数据表中添加 TSSOP 封装选项Go

Changes from C Revision (February 2010) to D Revision

  • Changed 国家数据表的布局以符合 TI 格式Go