ZHCSEU0A November   2015  – December 2015 LM5109B-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Start-up and UVLO
      2. 7.3.2 Level Shift
      3. 7.3.3 Output Stages
    4. 7.4 HS Transient Voltages Below Ground
    5. 7.5 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select Bootstrap and VDD Capacitor
        2. 8.2.2.2 Select External Bootstrap Diode and Its Series Resistor
        3. 8.2.2.3 Selecting External Gate Driver Resistor
        4. 8.2.2.4 Estimate the Driver Power Loss
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

NGT Package
8-Pin WSON
Top View
LM5109B-Q1 20211903.gif

Pin Functions

PIN I/O(1) DESCRIPTION APPLICATIONS INFORMATION
NO.(2) NAME
1 VDD P Positive gate drive supply Locally decouple to VSS using low ESR/ESL capacitor located as close to IC as possible.
2 HI I High side control input The HI input is TTL/CMOS Compatible input thresholds. Unused HI input should be tied to ground and not left open.
3 LI I Low side control input The LI input is TTL/CMOS Compatible input thresholds. Unused LI input should be tied to ground and not left open.
4 VSS G Ground reference All signals are referenced to this ground.
5 LO O Low side gate driver output Connect to the gate of the low-side N-MOS device.
6 HS P High side source connection Connect to the negative terminal of the bootstrap capacitor and to the source of the high-side N-MOS device.
7 HO O High side gate driver output Connect to the gate of the high-side N-MOS device.
8 HB P High side gate driver positive supply rail Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal of the bootstrap capacitor to HS. The bootstrap capacitor should be placed as close to IC as possible.
(1) P = Power, G = Ground, I = Input, O = Output, I/O = Input/Output
(2) For WSON-8 package, it is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PCB and the ground plane should extend out from underneath the package to improve heat dissipation.