SNVS307G September   2004  – April 2016 LM5010

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 Start-Up Regulator (VCC)
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 ON-Time Control
      6. 7.3.6 Current Limit
      7. 7.3.7 Soft Start
      8. 7.3.8 N-Channel Buck Switch and Driver
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1  R1 and R2
          2. 8.2.2.1.2  RON, FS
          3. 8.2.2.1.3  L1
          4. 8.2.2.1.4  RCL
          5. 8.2.2.1.5  C2 and R3
          6. 8.2.2.1.6  D1
          7. 8.2.2.1.7  C1
          8. 8.2.2.1.8  C3
          9. 8.2.2.1.9  C4
          10. 8.2.2.1.10 C5
          11. 8.2.2.1.11 C6
        2. 8.2.2.2 Increasing The Current Limit Threshold
        3. 8.2.2.3 Ripple Configuration
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from F Revision (February 2013) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from E Revision (February 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo