ZHCSF16S November   2004  – May 2016 LM3671 , LM3671-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM3671
    3. 6.3 ESD Ratings: LM3671-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Dissipation Ratings
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Circuit Operation
      2. 7.3.2 Soft Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
        1. 7.4.1.1 Internal Synchronous Rectification
        2. 7.4.1.2 Current Limiting
      2. 7.4.2 PFM Operation
      3. 7.4.3 Shutdown
      4. 7.4.4 Low Dropout Operation (LDO)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application: Fixed-Voltage Version
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
            1. 8.2.1.2.1.1 Method 1
            2. 8.2.1.2.1.2 Method 2
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application: ADJ Version
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Selection for LM3671-ADJ
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 DSBGA Package Assembly and Use
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from R Revision (November 2014) to S Revision

  • Added TI 设计的顶部导航图标Go
  • Added 若干新“应用" Go
  • moved storage temperature to Abs Max table Go
  • Changed Handling Ratings to ESD Ratings Go
  • Changed RθJA for USON from 165°C/W to 174.7°C/W; for SOT-23 from 130°C/W to 165.7°C/W, and for DSBGA from 85°C/W to 181.0°C/W; added additional thermal valuesGo
  • Changed RθJA values in Dissipation Ratings tableGo

Changes from Q Revision (November 2013) to R Revision

  • Added 器件信息表和处理额定值表,特性 描述器件功能模式应用和实施电源相关建议布局器件和文档支持以及机械、封装和可订购信息部分;已将一些曲线移至应用曲线部分。Go

Changes from O Revision (April 2013) to P Revision

  • Changed layout of National Data Sheet to TI formatGo