ZHCSCQ8D August   2014  – September 2015 LM3644

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flash Mode
      2. 8.3.2 Torch Mode
      3. 8.3.3 IR Mode
    4. 8.4 Device Functioning Modes
      1. 8.4.1 Start-Up (Enabling The Device)
      2. 8.4.2 Pass Mode
      3. 8.4.3 Power Amplifier Synchronization (TX)
      4. 8.4.4 Input Voltage Flash Monitor (IVFM)
      5. 8.4.5 Fault/Protections
        1. 8.4.5.1 Fault Operation
        2. 8.4.5.2 Flash Time-Out
        3. 8.4.5.3 Overvoltage Protection (OVP)
        4. 8.4.5.4 Current Limit
        5. 8.4.5.5 NTC Thermistor Input (Torch/Temp)
        6. 8.4.5.6 Undervoltage Lockout (UVLO)
        7. 8.4.5.7 Thermal Shutdown (TSD)
        8. 8.4.5.8 LED and/or VOUT Short Fault
    5. 8.5 Programming
      1. 8.5.1 Control Truth Table
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 Data Validity
        2. 8.5.2.2 Start and Stop Conditions
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 I2C-Compatible Chip Address
    6. 8.6 Register Descriptions
      1. 8.6.1  Enable Register (0x01)
      2. 8.6.2  IVFM Register (0x02)
      3. 8.6.3  LED1 Flash Brightness Register (0x03)
      4. 8.6.4  LED2 Flash Brightness Register (0x04)
      5. 8.6.5  LED1 Torch Brightness Register (0x05)
      6. 8.6.6  LED2 Torch Brightness Register (0x06)
      7. 8.6.7  Boost Configuration Register (0x07)
      8. 8.6.8  Timing Configuration Register (0x08)
      9. 8.6.9  TEMP Register (0x09)
      10. 8.6.10 Flags1 Register (0x0A)
      11. 8.6.11 Flags2 Register (0x0B)
      12. 8.6.12 Device ID Register (0x0C)
      13. 8.6.13 Last Flash Register (0x0D)
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Capacitor Selection
        2. 9.2.2.2 Input Capacitor Selection
        3. 9.2.2.3 Inductor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 相关文档
      1. 12.2.1 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。