ZHCSCQ8D August   2014  – September 2015 LM3644

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flash Mode
      2. 8.3.2 Torch Mode
      3. 8.3.3 IR Mode
    4. 8.4 Device Functioning Modes
      1. 8.4.1 Start-Up (Enabling The Device)
      2. 8.4.2 Pass Mode
      3. 8.4.3 Power Amplifier Synchronization (TX)
      4. 8.4.4 Input Voltage Flash Monitor (IVFM)
      5. 8.4.5 Fault/Protections
        1. 8.4.5.1 Fault Operation
        2. 8.4.5.2 Flash Time-Out
        3. 8.4.5.3 Overvoltage Protection (OVP)
        4. 8.4.5.4 Current Limit
        5. 8.4.5.5 NTC Thermistor Input (Torch/Temp)
        6. 8.4.5.6 Undervoltage Lockout (UVLO)
        7. 8.4.5.7 Thermal Shutdown (TSD)
        8. 8.4.5.8 LED and/or VOUT Short Fault
    5. 8.5 Programming
      1. 8.5.1 Control Truth Table
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 Data Validity
        2. 8.5.2.2 Start and Stop Conditions
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 I2C-Compatible Chip Address
    6. 8.6 Register Descriptions
      1. 8.6.1  Enable Register (0x01)
      2. 8.6.2  IVFM Register (0x02)
      3. 8.6.3  LED1 Flash Brightness Register (0x03)
      4. 8.6.4  LED2 Flash Brightness Register (0x04)
      5. 8.6.5  LED1 Torch Brightness Register (0x05)
      6. 8.6.6  LED2 Torch Brightness Register (0x06)
      7. 8.6.7  Boost Configuration Register (0x07)
      8. 8.6.8  Timing Configuration Register (0x08)
      9. 8.6.9  TEMP Register (0x09)
      10. 8.6.10 Flags1 Register (0x0A)
      11. 8.6.11 Flags2 Register (0x0B)
      12. 8.6.12 Device ID Register (0x0C)
      13. 8.6.13 Last Flash Register (0x0D)
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Capacitor Selection
        2. 9.2.2.2 Input Capacitor Selection
        3. 9.2.2.3 Inductor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 相关文档
      1. 12.2.1 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 器件支持

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 相关文档

12.2.1 相关链接

列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，以及样片或购买的快速访问。

Table 3. 相关链接

器件 产品文件夹 样片与购买 技术文档 工具与软件 支持与社区
LM3644 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
LM3644TT 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

12.3 商标

All trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

12.5 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、缩写和定义。