ZHCSH22C January 2009 – November 2017 LM3241
PRODUCTION DATA.
The LM3241 is a simple, step-down DC-DC converter optimized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery-powered RF devices. The device is designed to allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single Li-Ion battery cell. The design is based on a voltage-mode buck architecture, with synchronous rectification for high efficiency. The device is designed for a maximum load capability of 750 mA in PWM mode. Maximum load range may vary from this depending on input voltage, output voltage, and the inductor chosen.
Three modes of operation are available depending on the current required: pulse width modulation (PWM), Eco-mode (economy mode), and shutdown. The LM3241 operates in PWM mode at higher load-current conditions. Lighter loads cause the device to automatically switch into Eco-mode. Shutdown mode turns off the device and reduces battery consumption to 0.1 µA (typical).
Precision of the DC PWM-mode output voltage is ±2% for 3.4 VOUT. Efficiency is around 95% (typical) for a 500-mA load with a 3.3-V output and 3.9-V input. The output voltage is dynamically programmable from 0.6 V to 3.4 V by adjusting the voltage on the control pin (VCON) without the need for external feedback resistors. This feature ensures longer battery life by being able to change the PA supply voltage dynamically depending on its transmitting power.
Additional features include current overload protection and thermal overload shutdown.
The LM3241 is constructed using a chip-scale, 6-bump DSBGA package. This package offers the smallest possible size for space-critical applications, such as cell phones, where board area is an important design consideration. Use of a high switching frequency (6 MHz, typical) reduces the size of external components. As shown in Figure 29, only three external power components are required for implementation. Use of a DSBGA package requires special design considerations for implementation (for more information see the DSBGA Package Assembly and Use section.) The fine-bump pitch of the package requires careful board design and precision assembly equipment. Use of this package is best suited for opaque-case applications, where its edges are not subject to high-intensity ambient red or infrared light. Also, the system controller should set EN low during power-up and other low supply voltage conditions (see the Shutdown Mode section).