ZHCSH22C January   2009  – November 2017 LM3241

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Circuit Operation
      2. 7.3.2 Internal Synchronization Rectification
      3. 7.3.3 Current Limiting
      4. 7.3.4 Dynamically Adjustable Output Voltage
      5. 7.3.5 Thermal Overload Protection
      6. 7.3.6 Soft Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode Operation
      2. 7.4.2 Eco-mode™ Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Inductor Selection
          1. 8.2.2.2.1 Method 1
          2. 8.2.2.2.2 Method 2
        3. 8.2.2.3 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 DSBGA Package Assembly and Use
      2. 10.1.2 Board Layout Considerations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Recommended Operating Conditions

See (1).
MINNOMMAXUNIT
Input voltage 2.7 5.5 V
Recommended load current 0 750 mA
TJ Junction temperature –40 125 °C
TA Ambient temperature(2) –40 85 °C
(1) All voltages are with respect to the potential at the GND pins.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).