ZHCSDP4B May   2015  – February 2017 LM2776

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Current Limit
      2. 7.3.2 PFM Operation
      3. 7.3.3 Output Discharge
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Enable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application - Voltage Inverter
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Requirements
        1. 8.2.2.1 Efficiency
        2. 8.2.2.2 Power Dissipation
        3. 8.2.2.3 Capacitor Selection
        4. 8.2.2.4 Output Capacitor and Output Voltage Ripple
        5. 8.2.2.5 Input Capacitor
        6. 8.2.2.6 Flying Capacitor
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply voltage (VIN to GND, or GND to VOUT) 6 V
EN (GND − 0.3) (VIN + 0.3) V
VOUT continuous output current 250 mA
Operating junction temperature, TJMax(3) 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA) / RθJA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Junction temperature –40 125 °C
Ambient temperature –40 85 °C
Input voltage 2.7 5.5 V
Output current 0 200 mA

6.4 Thermal Information

THERMAL METRIC(1) LM2776 UNIT
DBV (SOT)
6 PINS
RθJA Junction-to-ambient thermal resistance 187 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 158.2 °C/W
RθJB Junction-to-board thermal resistance 33.3 °C/W
ψJT Junction-to-top characterization parameter 37.8 °C/W
ψJB Junction-to-board characterization parameter 32.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Typical limits tested at TA = 25°C. Minimum and maximum limits apply over the full operating ambient temperature range (−40°C ≤ TA ≤ +85°C). VIN = 3.6 V, CIN = COUT = 2.2 µF, C1 = 1 µF
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IQ Supply current EN = 1. No load 100 200 µA
ISD Shutdown supply current EN = 0 0.1 1 µA
VEN Enable pin input threshold voltage Normal operation 1.2 V
Shutdown mode 0.4
ROUT Output resistance 2.5 Ω
ICL Output current limit 400 mA
UVLO Undervoltage lockout VIN Falling 2.4 V
VIN Rising 2.6

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ƒSW Switching frequency 1.7 2 2.3 MHz

6.7 Typical Characteristics

(典型应用 circuit, VIN = 3.6 V unless otherwise specified.)
LM2776 D001_SNVSA56.gif
VIN = 5.5 V
Figure 1. Output Ripple vs Output Current
LM2776 D002_SNVSA56.gif
IOUT = 100 mA
Figure 2. Output Ripple vs Input Voltage
LM2776 D003_SNVSA56.gif
Figure 3. Shutdown Current vs Input Voltage
LM2776 D006_SNVSA56-LM2776.gif
VIN = 5.5 V
Figure 5. Output Impedance vs Output Current
LM2776 D008_SNVSA56-LM2776.gif
VIN = 3.6 V
Figure 7. Efficiency vs Output Current
LM2776 D010_SNVSA56-LM2776.gif
VIN = 3.6 V
Figure 9. Output Voltage vs Output Current
LM2776 5.5V_Ripple_0mA_snvsa56.gif
IOUT = 0 mA VIN = 5.5 V
Figure 11. Unloaded Output Voltage Ripple
LM2776 EN_high_snvsa56.gif
EN = 1 VIN = 5.5 V IOUT = 100 mA
Figure 13. EN High
LM2776 Line_Step_5.5_to_5_snvsa56.gif
IOUT = 75 mA
Figure 15. Line Step 5.5 V to 5 V
LM2776 Output_Short_5.5V_snvsa56.gif
VIN = 5.5 V
Figure 17. Output Short
LM2776 D004_SNVSA56.gif
No load
Figure 4. Quiescent Current vs Input Voltage
LM2776 D007_SNVSA56-LM2776.gif
VIN = 5.5 V
Figure 6. Efficiency vs Output Current
LM2776 D009_SNVSA56-LM2776.gif
VIN = 5.5 V
Figure 8. Output Voltage vs Output Current
LM2776 D011_SNVSA56.gif
IOUT = 150 mA
Figure 10. Frequency vs Input Voltage
LM2776 5.5V_Ripple_200mA_snvsa56.gif
IOUT = 200 mA VIN = 5.5 V
Figure 12. Loaded Output Voltage Ripple
LM2776 EN_low_snvsa56.gif
EN = 0 VIN = 5.5 V IOUT = 100 mA
Figure 14. EN Low
LM2776 Loadstep_10_to_100_snvsa56.gif
VIN = 5.5 V
Figure 16. Load Step 10 mA to 100 mA