ZHCSF17E April   2008  – May 2016 LM2758

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Charge Pump and Gain Transitions
      2. 7.3.2 Soft Start
      3. 7.3.3 Current Limit Protection
      4. 7.3.4 Flash Time-out Feature
      5. 7.3.5 Setting LED Currents
      6. 7.3.6 Analog Brightness Control
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes
      2. 7.4.2 Logic Control Pins
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Power Efficiency
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 DSBGA Package Assembly and Use
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
VIN, CPOUT pins: voltage to GND –0.3 6 V
EN1, EN2 pins: Voltage to GND –0.3 (VIN + 0.3) w/ 6 V maximum V
Continuous power dissipation
Junction temperature, TJ-MAX 150 °C
Maximum lead temperature (soldering) See(4)
Storage temperature, Tstg –65°C 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) All voltages are with respect to the potential to the GND pin.
(4) For detailed soldering specifications and information, see AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage 2.7 5.5 V
Junction temperature, TJ –40 125 °C
Ambient temperature, TA (2) –40 85 °C
(1) All voltages are with respect to the potential at the GND pin.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

THERMAL METRIC(1) LM2758 UNIT
YZR (DSBGA)
12 PINS
RθJA Junction-to-ambient thermal resistance 93.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.7 °C/W
RθJB Junction-to-board thermal resistance 16.1 °C/W
ψJT Junction-to-top characterization parameter 2.9 °C/W
ψJB Junction-to-board characterization parameter 16.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified, aspecifications apply to the Figure 8 with VIN = 3.6 V, VEN1 = VIN, VEN2 = 0 V,
C1 = C2 = 1 µF, CIN = COUT = 2.2 µF, RSET = 20 kΩ, TJ = 25°C.(1)(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ILED LED current accuracy ILED = 500 mA, flash mode 500
ILED = 500 mA, flash mode
–40°C ≤ TJ ≤ 125°C		 450 550 mA
VSET ISET pin voltage 1.3 V
ID/ISET LED current to set current ratio Flash mode 7650
Torch mode 1639
ILED-IND Indicator current level Indicator mode
32-kHZ PWM mode		 1/32 × ILED-TORCH mA
VGDX 1× to 1.5× gain transition voltage threshold on VLED– IOUT = 500 mA 300 mV
VOUT Output voltage 1× mode, IOUT = 0 mA VIN V
1.5× mode, IOUT = 0 mA(4) 4.8
1.5× mode, IOUT = 0 mA
–40°C ≤ TJ ≤ 125°C(4)		 5.3
ROUT 1× mode output impedance IOUT = 200 mA, VIN = 3.3 V
–40°C ≤ TJ ≤ 125°C		 0.33 Ω
IOUT = 200 mA, VIN = 3.3 V(5) 0.53
1.5× mode output impedance IOUT = 500 mA, VIN = 3.3 V(5) 1.5 2.0
FSW Switching frequency 1.25 MHz
–40°C ≤ TJ ≤ 125°C 0.8 1.5
IQ Quiescent current IOUT = 0 mA 1× mode, –40°C ≤ TJ ≤ 125°C 0.7 mA
IOUT = 0 mA 1x mode 0.8
IOUT = 0 mA 1.5× mode 4
IOUT = 0 mA 1.5× mode, –40°C ≤ TJ ≤ 125°C 5
ISD Shutdown current Device disabled(6) 0.01 µA
Device disabled, –40°C ≤ TJ ≤ 125°C(6) 1
TOUT Timeout duration –40°C ≤ TJ ≤ 125°C, see(7) 814 msec
See(7) 640 1000
VIH Input logic high Pins: EN1, EN2, –40°C ≤ TJ ≤ 125°C 1.2 V
VIL Input logic low Pins: EN1, EN2, –40°C ≤ TJ ≤ 125°C 0.4 V
(1) All voltages are with respect to the potential at the GND pin.
(2) Minimum (MIN) and maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not ensured, but do represent the most likely norm. Unless otherwise specified, conditions for TTYP specifications are: VIN = 3.6 V and TA = 25°C.
(3) CIN, COUT, C1, C2: Low-ESR surface-mount ceramic capacitors (MLCCs) used in setting electrical characteristics.
(4) Output voltage is internally limited not to exceed maximum specified value.
(5) These table entries are specified by design. These parameters are not ensured by production testing. The temperature limits for test are (–40°C ≤ TA ≤ +85°C).
(6) The temperature limits for ISD (shutdown current) test are -40°C ≤ TA ≤ +85°C, as in shutdown mode ambient temperature is equal to junction temperature.
(7) The timeout specifications are calculated values based on the switching frequency spread.

6.6 Typical Characteristics

Unless otherwise specified: TA = 25°C, VIN = 3.6 V, CIN = COUT = 2.2 µF, C1 = C2 = 1 µF. Capacitors are low-ESR multi-layer ceramic capacitors (MLCCs). Luxeon PWF1 Flash LED.
LM2758 30045304.gif
Figure 1. Efficiency vs VIN
LM2758 30045306.gif
Figure 3. Quiescent Current vs VIN
LM2758 30045308.gif
Figure 5. ILED vs VLED–
LM2758 30045305.gif
Figure 2. Oscillator Frequency vs VIN
LM2758 30045307.gif
Figure 4. Shutdown Current vs VIN
LM2758 30045309.gif
Figure 6. LED Current vs RSET