SNVS136L September   1998  – June 2016 LM2672

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - 3.3 V
    6. 7.6  Electrical Characteristics - 5 V
    7. 7.7  Electrical Characteristics - 12 V
    8. 7.8  Electrical Characteristics - Adjustable
    9. 7.9  Electrical Characteristics - All Output Voltage Versions
    10. 7.10 Typical Characteristics
    11. 7.11 Typical Characteristics - Fixed Output Voltage Versions
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Switch Output
      2. 9.3.2 C Boost
      3. 9.3.3 SYNC
      4. 9.3.4 Feedback
    4. 9.4 Device Functional Modes
      1. 9.4.1 ON/OFF
      2. 9.4.2 Shutdown Mode
      3. 9.4.3 Active Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application for Fixed Output Voltage Versions
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Inductor Selection (L1)
          2. 10.2.1.2.2 Output Capacitor Selection (COUT)
          3. 10.2.1.2.3 Catch Diode Selection (D1)
          4. 10.2.1.2.4 Input Capacitor (CIN)
          5. 10.2.1.2.5 Boost Capacitor (CB)
          6. 10.2.1.2.6 Soft-Start Capacitor (CSS, Optional)
          7. 10.2.1.2.7 Frequency Synchronization (Optional)
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application for Adjustable Output Voltage Versions
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Programming Output Voltage
          2. 10.2.2.2.2 Inductor Selection (L1)
          3. 10.2.2.2.3 Output Capacitor SeIection (COUT)
          4. 10.2.2.2.4 Catch Diode Selection (D1)
          5. 10.2.2.2.5 Input Capacitor (CIN)
          6. 10.2.2.2.6 Boost Capacitor (CB)
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 WSON Package Devices
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 DAP (WSON Package)

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

D or P Package
8-Pin SOIC or PDIP
Top View
NHN Package
16-Pin WSON
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME SOIC, PDIP WSON
CB 1 1 I Boot-strap capacitor connection for high-side driver. Connect a high quality 100-nF capacitor from CB to VSW Pin.
FB 4 8 I Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT for ADJ version or connect this pin directly to the output capacitor for a fixed output version.
GND 6 11, 12 — Power ground pins. Connect to system ground. Ground pins of CIN and COUT. Path to CIN must be as short as possible.
NC — 2, 3, 5,
7, 10, 13		 — No connection pins.
ON/OFF 5 9 I Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin high or float to enable the regulator.
SS 2 4 I Soft-start capacitor pin. Connect a capacitor from this pin to GND to control the output voltage ramp. If the feature not desired, the pin can be left floating.
SYNC 3 6 I This input allows control of the switching clock frequency. If left open-circuited the regulator is switched at the internal oscillator frequency, typically 260 kHz.
VIN 7 14 I Supply input pin to collector pin of high side FET. Connect to power supply and input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible.
VSW 8 15, 16 O Source pin of the internal High Side FET. This is a switching node. Attached this pin to an inductor and the cathode of the external diode.