ZHCSG23A March   2017  – February 2018 LM25141-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Voltage Start-Up Regulator
      2. 7.3.2  VCC Regulator
      3. 7.3.3  Oscillator
      4. 7.3.4  Synchronization
      5. 7.3.5  Frequency Dithering (Spread Spectrum)
      6. 7.3.6  Enable
      7. 7.3.7  Power Good
      8. 7.3.8  Output Voltage
        1. 7.3.8.1 Minimum Output Voltage Adjustment
      9. 7.3.9  Current Sense
      10. 7.3.10 DCR Current Sensing
      11. 7.3.11 Error Amplifier and PWM Comparator
      12. 7.3.12 Slope Compensation
      13. 7.3.13 Hiccup Mode Current Limiting
      14. 7.3.14 Standby Mode
      15. 7.3.15 Soft Start
      16. 7.3.16 Diode Emulation
      17. 7.3.17 High- and Low-Side Drivers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Inductor Calculation
        3. 8.2.2.3 Current Sense Resistor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Input Filter
          1. 8.2.2.5.1 EMI Filter Design
          2. 8.2.2.5.2 MOSFET Selection
          3. 8.2.2.5.3 Driver Slew Rate Control
          4. 8.2.2.5.4 Frequency Dithering
        6. 8.2.2.6 Control Loop
          1. 8.2.2.6.1 Feedback Compensator
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Procedure
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
        1. 11.2.1.1 PCB 布局资源
        2. 11.2.1.2 热设计资源
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Oscillator frequency 2.2 MHz OSC = VDDA, VIN = 8–18 V 2100 2200 2300 kHz
Oscillator frequency 440 kHz OSC = GND, VIN = 8–18 V 420 440 460 kHz
RT Adjustment range
2.2 MHz 		Minimum OSC = VDD, RTMIN = 61.9 kΩ 1710 1800 1890 kHz
Typical OSC = VDD, RTTYP = 49.9 kΩ 2100 2200 2300 kHz
Maximum OSC = VDD, RTMAX = 43.2 kΩ 2405 2530 2655 kHz
RT Adjustment range
440 kHz 		Minimum OSC = GND, RTMIN = 73.2 k 285 300 315 kHz
Typical OSC = GND, RTTYP = 49.9 kΩ 420 440 460 kHz
Maximum OSC = GND, RTMAX = 44.2 kΩ 475 500 525 kHz
RT Response time RT= 61.9–43.2 kΩ 2 µs
RT Response time RT = 43.2–61.9 kΩ 3.5 µs
RT Response time 16 µs
ton Minimum on-time 45 66 ns
toff Minimum off-time 100 ns