SNVSCV3
December 2025
LM25137F
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Related Products
5
Device and Documentation Support
5.1
Device Support
5.1.1
Third-Party Products Disclaimer
5.1.2
Development Support
5.1.2.1
Custom Design With WEBENCH® Tools
5.2
Documentation Support
5.2.1
Related Documentation
5.2.1.1
Low-EMI Design Resources
5.2.1.2
Thermal Design Resources
5.2.1.3
PCB Layout Resources
5.3
Receiving Notification of Documentation Updates
5.4
Support Resources
5.5
Trademarks
5.6
Electrostatic Discharge Caution
5.7
Glossary
6
Revision History
7
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RHA|36
MPQF611A
散热焊盘机械数据 (封装 | 引脚)
RHA|36
QFND795
订购信息
snvscv3_oa
snvscv3_pm
5.2.1.2
Thermal Design Resources
Texas Instruments,
Improving Thermal Performance in High Ambient Temperature Environments With Thermally Enhanced Packaging
white paper
Applications notes:
Texas Instruments,
Thermal Design by Insight, Not Hindsight
Texas Instruments,
A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
Using New Thermal Metrics
Texas Instruments,
PowerPAD™ Made Easy
application brief