ZHCS535M February   2013  – October 2020 LM22679 , LM22679-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings: LM22679
    3. 6.3 Handling Ratings: LM22679-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 UVLO
      2. 7.3.2 Soft-Start
      3. 7.3.3 Bootstrap Supply
      4. 7.3.4 Internal Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Current Limit
      4. 7.4.4 Current Limit Adjustment
      5. 7.4.5 Thermal Protection
      6. 7.4.6 Duty-Cycle Limits
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Divider Selection
      2. 8.1.2 Power Diode
    2. 8.2 Typical Application
      1. 8.2.1 Typical Buck Regulator Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Components
          2. 8.2.1.2.2 Inductor
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Bootstrap Capacitor
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 支持资源
    3. 11.3 接收文档更新通知
    4. 11.4 Trademarks
    5. 11.5 术语表
    6. 11.6 静电放电警告

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Considerations

The components with the highest power dissipation are the power diode and the power MOSFET internal to the LM22679 regulator. The easiest method to determine the power dissipation within the LM22679 is to measure the total conversion losses then subtract the power losses in the diode and inductor. The total conversion loss is the difference between the input power and the output power. An approximation for the power diode loss is shown in Equation 16.

Equation 16. GUID-D61FE8CE-768C-4012-BDDD-B1902B3C11CF-low.gif

where

  • VD is the diode voltage drop

An approximation for the inductor power is shown in Equation 17.

Equation 17. GUID-0E372581-218C-44E4-9B21-40EE0EC329E5-low.gif

where

  • RL is the dc resistance of the inductor
  • The 1.1 factor is an approximation for the ac losses

The regulator has an exposed thermal pad to aid power dissipation. Adding multiple vias under the device to the ground plane will greatly reduce the regulator junction temperature. Selecting a diode with an exposed pad will also aid the power dissipation of the diode. The most significant variables that affect the power dissipation of the regulator are output current, input voltage and operating frequency. The power dissipated while operating near the maximum output current and maximum input voltage can be appreciable. The junction-to-ambient thermal resistance of the LM22679 will vary with the application. The most significant variables are the area of copper in the PC board, the number of vias under the IC exposed pad and the amount of forced air cooling provided. A large continuos ground plane on the top or bottom PCB layer will provide the most effective heat dissipation. The integrity of the solder connection from the IC exposed pad to the PC board is critical. Excessive voids will greatly diminish the thermal dissipation capacity. The junction-to-ambient thermal resistance of the LM22679 PFM package is specified in Section 6.6. See AN-2020 Thermal Design By Insight, Not Hindsight (SNVA419) for more information.