ZHCSQR7 October   2023 ISOTMP35

ADVANCE INFORMATION  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specification
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
        1. 7.3.2.1 Output Accuracy
        2. 7.3.2.2 Output Voltage Linearity
        3. 7.3.2.3 Drive Capability
      3. 7.3.3 Thermal Response
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
  • DFQ|7
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

at TA = 25°C, (unless otherwise noted)

GUID-6A9C853E-6497-41DE-AD49-4B8D17D4B848-low.gif
VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF
Figure 6-1 Accuracy vs TA Temperature
GUID-EA0367ED-517D-4301-91E3-E4DFBB7DF758-low.gif
IOUT = from 0 µA to 100 µA, CLOAD = 1000 pF
Figure 6-3 Changes in Accuracy vs Ambient Temperature (Due to Load)
GUID-E16DD7BC-893F-49DC-8FF6-77D38EA7AD38-low.gif
VDD = 2.3 V, CLOAD = 1000 pF
Figure 6-5 Load Regulation vs Ambient Temperature
GUID-7093A9C0-2EA0-4EB7-8DEF-0A228A26EDBD-low.gif
TA = 25°C
Figure 6-7 Output Voltage vs Power Supply
GUID-B7B53CAB-FF2E-4A29-8790-4FA71C53F6AF-low.gif
TA = 25°C, VDD Ramp Rate = 5 V/ms
Figure 6-9 Output vs. Settling Time to Ramp VDD
GUID-052C4682-083A-4CD1-915A-D6CD183A15EC-low.gif
TA = 25°C, VDD = 5 V, IOUT = 100 µA
Figure 6-11 Output Impedance vs Frequency
GUID-B7B53CAB-FF2E-4A29-8790-4FA71C53F6AF-low.gif
TA = 25°C
Figure 6-13 Output Noise Density
GUID-20230816-SS0I-DVZS-ZVTH-RN3X2S43R0XM-low.png
IOUT = 0 µA, CLOAD = 1000 pF
Figure 6-2 Output Voltage vs Ambient Temperature
GUID-22DF8684-3EEF-4694-A028-E813AAE9153E-low.gif
IOUT = 0 µA, CLOAD = 1000 pF
Figure 6-4 Supply Current vs Temperature
GUID-060FDA7A-5EBE-45CA-B408-5A1EE98E3545-low.gif
VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF
Figure 6-6 Line Regulation (Δ°C / ΔVDD) vs Ambient Temperature
GUID-B7B53CAB-FF2E-4A29-8790-4FA71C53F6AF-low.gif
TA = 25°C
Figure 6-8 Output vs. Settling Time to Step VDD
GUID-B7B53CAB-FF2E-4A29-8790-4FA71C53F6AF-low.gif
1 × 1 (inches) PCB, Air 26°C to Fluid Bath 123°C
Figure 6-10 Thermal Response (Air-to-Fluid Bath)
GUID-B7B53CAB-FF2E-4A29-8790-4FA71C53F6AF-low.gif
TA = 25°C
Figure 6-12 PSRR vs Frequency