ZHCS221F April   2013  – January 2015 ISO7131CC , ISO7140CC , ISO7140FCC , ISO7141CC , ISO7141FCC

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Dissipation Ratings
    6. 6.6  Electrical Characteristics: VCC1 and VCC2 at 5 V ±10%
    7. 6.7  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 2.7 V
    9. 6.9  Switching Characteristics: VCC1 and VCC2 at 5 V ±10%
    10. 6.10 Switching Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    11. 6.11 Switching Characteristics: VCC1 and VCC2 at 2.7 V
    12. 6.12 Supply Current: VCC1 and VCC2 at 5 V ±10%
    13. 6.13 Supply Current: VCC1 and VCC2 at 3.3 V ±10%
    14. 6.14 Supply Current: VCC1 and VCC2 at 2.7 V
    15. 6.15 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Insulation and Safety-Related Specifications
        1. 8.3.1.1 Safety Limiting Values
        2. 8.3.1.2 Regulatory Information
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Isolated Data Acquisition System for Process Control
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Isolated RS-485 Interface
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Detailed Description

8.1 Overview

The isolator in Figure 14 is based on a capacitive isolation barrier technique. The I/O channel of the device consists of two internal data channels, a high-frequency channel (HF) with a bandwidth from 100 kbps up to
150 Mbps, and a low-frequency channel (LF) covering the range from 100 kbps down to DC. In principle, a single-ended input signal entering the HF-channel is split into a differential signal through the inverter gate at the input. The following capacitor-resistor networks differentiate the signal into transients, which then are converted into differential pulses by two comparators. The comparator outputs drive a NOR-gate flip-flop whose output feeds an output multiplexer. A decision logic (DCL) at the driving output of the flip-flop measures the durations between signal transients. If the duration between two consecutive transients exceeds a certain time limit, (as in the case of a low-frequency signal), the DCL forces the output-multiplexer to switch from the high- to the low-frequency channel.

Because low-frequency input signals require the internal capacitors to assume prohibitively large values, these signals are pulse-width modulated (PWM) with the carrier frequency of an internal oscillator, thus creating a sufficiently high frequency signal, capable of passing the capacitive barrier. As the input is modulated, a low-pass filter (LPF) is needed to remove the high-frequency carrier from the actual data before passing it on to the output multiplexer.

8.2 Functional Block Diagram

ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC fbdc_slls868.gifFigure 14. Conceptual Block Diagram of a Digital Capacitive Isolator

8.3 Feature Description

Table 1. Product Features

PRODUCT RATED
ISOLATION
INPUT
THRESHOLD
DEFAULT
OUTPUT
MAX DATA RATE
and
INPUT FILTER
CHANNEL
DIRECTION
ISO7131CC 4242 VPK(1) 1.5-V TTL
(CMOS compatible)
High 50 Mbps,
with noise filter integrated
2 forward,
1 reverse
ISO7140CC 4 forward,
0 reverse
ISO7140FCC Low
ISO7141CC High 3 forward,
1 reverse
ISO7141FCC Low
(1) See Regulatory Information for detailed Isolation Ratings.

8.3.1 Insulation and Safety-Related Specifications

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIOTM Maximum transient overvoltage per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 4242 VPK
VIORM Maximum working voltage per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 566 VPK
VISO Isolation Voltage per UL 1577 VTEST = VISO, t = 60 sec (qualification) 2500 VRMS
VTEST = 1.2 * VISO, t = 1 sec (100% production) 3000
VPR Input-to-output test voltage per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 After Input/Output safety test subgroup 2/3,
VPR = VIORM x 1.2, t = 10 s,
Partial discharge < 5 pC
679 VPK
Method a, After environmental tests subgroup 1,
VPR = VIORM x 1.6, t = 10 s,
Partial discharge < 5 pC
906
Method b1, 100% production test,
VPR = VIORM x 1.875, t = 1 s,
Partial discharge < 5 pC
1061
L(I01) Minimum air gap (clearance) Shortest terminal to terminal distance through air 3.7 mm
L(I02) Minimum external tracking (creepage) Shortest terminal to terminal distance across the package surface 3.7 mm
Minimum internal gap (internal clearance) Distance through the insulation 0.014 mm
Pollution degree 2
CTI Tracking resistance (comparative tracking index) DIN IEC 60112 / VDE 0303 Part 1 ≥400 V
RIO(1) Isolation Resistance, Input to Output VIO = 500 V, TA = 25oC >1012 Ω
VIO = 500 V, 100oC ≤ TA ≤ TA max >1011
CIO(1) Barrier capacitance, input to output VI = 0.4 sin (2πft), f = 1 MHz 2.3 pF
CI(2) Input capacitance VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V 2.8 pF
(1) All pins on each side of the barrier tied together creating a two-terminal device.
(2) Measured from input pin to ground.

NOTE

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit-board (PCB) do not reduce this distance.

Creepage and clearance on a PCB become equal in certain cases. Techniques such as inserting grooves and/or ribs on a PCB are used to help increase these specifications.

Table 2. IEC 60664-1 Ratings Table

PARAMETER TEST CONDITIONS SPECIFICATION
Basic Isolation Group Material Group II
Installation classification Rated mains voltage ≤ 150 VRMS I–IV
Rated mains voltage ≤ 300 VRMS I–III
Rated mains voltage ≤ 400 VRMS I–II

8.3.1.1 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current DBQ-16 RθJA = 104.5°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C 217 mA
RθJA = 104.5°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C 332
RθJA = 104.5°C/W, VI = 2.7V, TJ = 150°C, TA = 25°C 443
TS Maximum case temperature 150 °C

The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC Therm_derate_LLSE83.gifFigure 15. DBQ-16 θJC Thermal Derating Curve

8.3.1.2 Regulatory Information

VDE UL CSA CQC
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010-1 Recognized under UL 1577 Component Recognition Program Approved under CSA Component Acceptance Notice 5A, IEC 60950-1, and IEC 61010-1 Certified according to GB 4943.1-2011
Basic Insulation
Maximum Transient Overvoltage, 4242 VPK
Maximum Working Voltage, 566 VPK
Single protection, 2500 VRMS(1) Reinforced Insulation per CSA 60950-1-03 and IEC 60950-1 (2nd Ed.), 185 VRMS maximum working voltage
Basic Insulation per CSA 60950-1-03 and IEC 60950-1 (2nd Ed.), 370 VRMS maximum working voltage
Reinforced Insulation per CSA 61010-1-12 and IEC 61010-1 (3rd Edition), 150 VRMS maximum working voltage
Basic Insulation per CSA 61010-1-12 and IEC 61010-1 (3rd Edition), 300 VRMS maximum working voltage
Basic Insulation, Altitude ≤ 5000m, Tropical Climate, 250 VRMS maximum working voltage
Certificate number: 40016131 File number: E181974 Master contract number: 220991 Certificate number: CQC14001109540
(1) Production tested ≥ 3000 Vrms for 1 second in accordance with UL 1577.

8.4 Device Functional Modes

Table 3. Function Table(1)

VCCI VCCO INPUT
(INx)
OUTPUT ENABLE
(ENx)
OUTPUT (OUTx)
ISO71xxCC ISO71xxFCC
PU PU H H or open H H
L H or open L L
X L Z Z
Open H or open H L
PD PU X H or open H L
PD PU X L Z Z
PU PD X X Undetermined Undetermined
(1) VCCI = Input-side VCC; VCCO = Output-side VCC; PU = Powered Up (VCC ≥ 2.7 V); PD = Powered Down (VCC ≤ 2.1 V); X = Irrelevant; H = High Level; L = Low Level; Z = High Impedance
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC Device_IO_LLSE83.gifFigure 16. Device I/O Schematics