ZHCS221F April   2013  – January 2015 ISO7131CC , ISO7140CC , ISO7140FCC , ISO7141CC , ISO7141FCC

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Dissipation Ratings
    6. 6.6  Electrical Characteristics: VCC1 and VCC2 at 5 V ±10%
    7. 6.7  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 2.7 V
    9. 6.9  Switching Characteristics: VCC1 and VCC2 at 5 V ±10%
    10. 6.10 Switching Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    11. 6.11 Switching Characteristics: VCC1 and VCC2 at 2.7 V
    12. 6.12 Supply Current: VCC1 and VCC2 at 5 V ±10%
    13. 6.13 Supply Current: VCC1 and VCC2 at 3.3 V ±10%
    14. 6.14 Supply Current: VCC1 and VCC2 at 2.7 V
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Insulation and Safety-Related Specifications
        1. 8.3.1.1 Safety Limiting Values
        2. 8.3.1.2 Regulatory Information
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Isolated Data Acquisition System for Process Control
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Isolated RS-485 Interface
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
VCC1, VCC2 Supply voltage(2) –0.5 6 V
INx, ENx, OUTx Voltage –0.5 VCC+ 0.5(3) V
IO Output current –15 15 mA
TJ Maximum junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6 V

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC1, VCC2 Supply voltage 2.7 5.5 V
IOH High-level output current (VCC ≥ 3.0 V) –4 mA
High-level output current (VCC < 3.0 V) –2
IOL Low-level output current 4 mA
VIH High-level input voltage 2 5.5 V
VIL Low-level input voltage 0 0.8
tui Input pulse duration (VCC ≥ 4.5V) 20 ns
tui Input pulse duration (VCC < 4.5V) 25
1 / tui Signaling rate (VCC ≥ 4.5V) 0 50 Mbps
1 / tui Signaling rate (VCC < 4.5V) 0 40
TA Ambient temperature –40 25 125 °C
TJ Junction temperature –40 136

6.4 Thermal Information

THERMAL METRIC(1) ISO7131, ISO714x UNIT
DBQ
16 PINS
RθJA Junction-to-ambient thermal resistance 104.5 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 57.8 °C/W
RθJB Junction-to-board thermal resistance 46.8 °C/W
ψJT Junction-to-top characterization parameter 18.3 °C/W
ψJB Junction-to-board characterization parameter 46.4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Power Dissipation Ratings

TEST CONDITIONS VALUE UNIT
PD Device power dissipation VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF
Input a 25-MHz, 50% duty cycle square wave		 150 mW

6.6 Electrical Characteristics: VCC1 and VCC2 at 5 V ±10%

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 10 VCCO(1) – 0.5 4.8 V
IOH = –20 μA; see Figure 10 VCCO(1) – 0.1 5
VOL Low-level output voltage IOL = 4 mA; see Figure 10 0.2 0.4 V
IOL = 20 μA; see Figure 10 0 0.1
VI(HYS) Input threshold voltage hysteresis 450 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10 μA
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 13 25 75 kV/μs
(1) VCCO is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.

6.7 Electrical Characteristics: VCC1 and VCC2 at 3.3 V ±10%

VCC1 and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 10 VCCO(1) – 0.5 3 V
IOH = –20 μA; see Figure 10 VCCO(1) – 0.1 3.3
VOL Low-level output voltage IOL = 4 mA; see Figure 10 0.2 0.4 V
IOL = 20 μA; see Figure 10 0 0.1
VI(HYS) Input threshold voltage hysteresis 425 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10 μA
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 13 25 50 kV/μs
(1) VCCO is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.

6.8 Electrical Characteristics: VCC1 and VCC2 at 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –2 mA; see Figure 10 VCCO(1) – 0.3 2.5 V
IOH = –20 μA; see Figure 10 VCCO(1) – 0.1 2.7
VOL Low-level output voltage IOL = 4 mA; see Figure 10 0.2 0.4 V
IOL = 20 μA; see Figure 10 0 0.1
VI(HYS) Input threshold voltage hysteresis 350 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10 μA
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 13 25 50 kV/μs
(1) VCCO is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.

6.9 Switching Characteristics: VCC1 and VCC2 at 5 V ±10%

VCC1 and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 10 12 19 35 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 3
tsk(o)(2) Channel-to-channel output skew time Same-direction channels 2 ns
Opposite-direction channels 4
tsk(pp)(3) Part-to-part skew time 12 ns
tr Output signal rise time See Figure 10 2 ns
tf Output signal fall time 2 ns
tPHZ, tPLZ Disable propagation delay, high/low-to-high impedance output See Figure 11 6 10 ns
tPZH, tPZL Enable propagation delay, high impedance-to-high/low output 5 10 ns
tfs Fail-safe output delay time from input data or power loss See Figure 12 9.5 μs
tGR Input glitch rejection time 11 ns
(1) Also known as pulse skew
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals, and loads.

6.10 Switching Characteristics: VCC1 and VCC2 at 3.3 V ±10%

VCC1 and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 10 15 23 45 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 3
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2 ns
Opposite-direction Channels 4
tsk(pp)(3) Part-to-part skew time 19 ns
tr Output signal rise time See Figure 10 2.5 ns
tf Output signal fall time 2.5 ns
tPHZ, tPLZ Disable propagation delay, from high/low to high-impedance output See Figure 11 6.5 15 ns
tPZH, tPZL Enable propagation delay, from high-impedance to high/low output 6.5 15 ns
tfs Fail-safe output delay time from input data or power loss See Figure 12 8 μs
tGR Input glitch rejection time 12.5 ns
(1) Also known as pulse skew
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.11 Switching Characteristics: VCC1 and VCC2 at 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 10 15 27 50 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 3
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2 ns
Opposite-direction Channels 4
tsk(pp)(3) Part-to-part skew time 22 ns
tr Output signal rise time See Figure 10 3 ns
tf Output signal fall time 3 ns
tPHZ, tPLZ Disable propagation delay, from high/low to high-impedance output See Figure 11 9 15 ns
tPZH, tPZL Enable propagation delay, from high-impedance to high/low output 9 15 ns
tfs Fail-safe output delay time from input data or power loss See Figure 12 8.5 μs
tGR Input glitch rejection time 14 ns
(1) Also known as pulse skew
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals, and loads.

6.12 Supply Current: VCC1 and VCC2 at 5 V ±10%

VCC1 and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7131
ICC1 Disable EN1 = EN2 = 0 V 2.2 3.7 mA
ICC2 3.7 5
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 2.2 3.7 mA
ICC2 3.7 5
ICC1 10 Mbps 3.4 4.8
ICC2 4.9 6.6
ICC1 25 Mbps 4.9 6.6
ICC2 6.8 9
ICC1 50 Mbps 7.1 10
ICC2 10.5 13
ISO7140
ICC1 Disable EN = 0 V 0.6 1.2 mA
ICC2 4.6 7
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 0.6 1.3 mA
ICC2 4.8 7
ICC1 10 Mbps 1.4 2.2
ICC2 6.9 9.2
ICC1 25 Mbps 2.7 3.9
ICC2 10.3 13.5
ICC1 50 Mbps 4.7 6.5
ICC2 15.6 21
ISO7141
ICC1 Disable EN1 = EN2 = 0V 2.5 4.2 mA
ICC2 4.2 7
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square wave clock input; CL = 15 pF		 2.5 4.2 mA
ICC2 4.2 7
ICC1 10 Mbps 3.8 5.3
ICC2 6.2 9.6
ICC1 25 Mbps 5.6 7.5
ICC2 9.2 13
ICC1 50 Mbps 8.4 11.2
ICC2 14 18.5

6.13 Supply Current: VCC1 and VCC2 at 3.3 V ±10%

VCC1 and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7131
ICC1 Disable EN1 = EN2 = 0 V 1.9 2.7 mA
ICC2 2.6 3.8
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 1.9 2.7 mA
ICC2 2.6 3.8
ICC1 10 Mbps 2.4 3.5
ICC2 3.5 4.7
ICC1 25 Mbps 3.2 4.6
ICC2 4.7 6.2
ICC1 40 Mbps 5 7
ICC2 7 9
ISO7140
ICC1 Disable EN = 0 V 0.3 0.7 mA
ICC2 3.6 5.2
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 0.4 0.8 mA
ICC2 3.7 5.3
ICC1 10 Mbps 0.9 1.4
ICC2 5.1 6.8
ICC1 25 Mbps 1.7 2.4
ICC2 7.3 10
ICC1 40 Mbps 2.4 3.7
ICC2 9.4 13
ISO7141
ICC1 Disable EN1 = EN2 = 0 V 2 3.1 mA
ICC2 3.2 4.9
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 2 3.1 mA
ICC2 3.2 4.9
ICC1 10 Mbps 2.8 3.8
ICC2 4.5 6.1
ICC1 25 Mbps 4 5.2
ICC2 6.4 8.3
ICC1 40 Mbps 5 8
ICC2 8.2 11.6

6.14 Supply Current: VCC1 and VCC2 at 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7131
ICC1 Disable EN1 = EN2 = 0 V 1.2 2.4 mA
ICC2 2.3 3.3
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 1.2 2.4 mA
ICC2 2.3 3.3
ICC1 10 Mbps 2.1 3
ICC2 2.9 4
ICC1 25 Mbps 3 3.8
ICC2 4 5.2
ICC1 40 Mbps 4.2 5.3
ICC2 5.8 7
ISO7140
ICC1 Disable EN = 0 V 0.2 0.4 mA
ICC2 3.2 4.7
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 0.2 0.5 mA
ICC2 3.4 4.8
ICC1 10 Mbps 0.6 1
ICC2 4.5 6.3
ICC1 25 Mbps 1.2 1.8
ICC2 6.2 8
ICC1 40 Mbps 1.8 2.6
ICC2 8 11
ISO7141
ICC1 Disable EN1 = EN2 = 0 V 1.6 2.6 mA
ICC2 2.8 4.1
ICC1 DC to 1 Mbps DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 1.6 2.6 mA
ICC2 2.8 4.1
ICC1 10 Mbps 2.3 3.2
ICC2 3.8 5
ICC1 25 Mbps 3.3 4.2
ICC2 5.4 6.8
ICC1 40 Mbps 4.3 5.8
ICC2 6.9 9.2

6.15 Typical Characteristics

ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C001_SLLSE83.pngFigure 1. ISO7131 Supply Current for All Channels vs Data Rate
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C010_SLLSE83.pngFigure 3. ISO7141 Supply Current for All Channels vs Data Rate
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C003_SLLSE83.pngFigure 5. Low-Level Output Voltage vs Low-Level Output Current
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C005_SLLSE83.pngFigure 7. Propagation Delay Time vs Free-Air Temperature
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C007_SLLSE83.pngFigure 9. Input Glitch Rejection vs Free-Air Temperature
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C011_SLLSE83.pngFigure 2. ISO7140 Supply Current for All Channels vs Data Rate
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C002_SLLSE83.pngFigure 4. High-Level Output Voltage vs High-Level Output Current
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C004_SLLSE83.gifFigure 6. VCC Undervoltage Threshold vs Free-Air Temperature
ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC C006_SLLSE83.pngFigure 8. Output Jitter vs Data Rate