SLLSG01B September   2024  – November 2025 ISO6440 , ISO6441 , ISO6442

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5V Supply
    10. 6.10 Supply Current Characteristics—5V Supply
    11. 6.11 Electrical Characteristics—3.3V Supply
    12. 6.12 Supply Current Characteristics—3.3V Supply
    13. 6.13 Electrical Characteristics—2.5V Supply 
    14. 6.14 Supply Current Characteristics—2.5V Supply
    15. 6.15 Switching Characteristics—5V Supply
    16. 6.16 Switching Characteristics—3.3V Supply
    17. 6.17 Switching Characteristics—2.5V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   27
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information
    1.     58
    2.     59
    3.     60

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|16
  • DW|16
  • DFP|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) UNIT
PACKAGE PINS RθJA RθJC(top) RθJB ψJT ψJB RθJC(bot)
DW (Wide-SOIC) 16 83 48.5 49 28 48.4 NA °C/W
DFP (Wide-SSOP) 16 113.3 63.6 75.6 32.5 74.4 NA °C/W
DBQ (SSOP) 16 117.8 60 69.8 29.9 69 NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.