ZHCSGU8E June   2017  – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.          应用图表
      2.      ISO121x 器件与传统解决方案相比可降低电路板温度
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC Specification
    10. 6.10 Switching Characteristics—AC Specification
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Sinking Inputs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 9.2.1.2.2 Thermal Considerations
          3. 9.2.1.2.3 Designing for 48-V Systems
          4. 9.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 9.2.1.2.5 Surge, ESD, and EFT Tests
          6. 9.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 9.2.1.2.7 Status LEDs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Sourcing Inputs
      3. 9.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

ISO1211 D Package
8-Pin SOIC
Top View
ISO1211 ISO1212 pin_config_sllu258.gif

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 VCC1 — Power supply, side 1
2 EN I Output enable. The output pin on side 1 is enabled when the EN pin is high or open. The output pin on side 1 is in the high-impedance state when the EN pin is low. In noisy applications, tie the EN pin to VCC1.
3 OUT O Channel output
4 GND1 — Ground connection for VCC1
5 SUB — Internal connection to input chip substrate. Leave this pin unconnected on the board.
6 FGND — Field-side ground
7 IN I Field-side current input
8 SENSE I Field-side voltage sense
ISO1212 DBQ Package
16-Pin SSOP
Top View
ISO1211 ISO1212 iso1212-isolated-digital-input-receiver-pin-configuration.gif

Pin Functions

PIN I/O Description
NO. NAME
1 GND1 — Ground connection for VCC1
2 VCC1 — Power supply, side 1
3 EN I Output enable. The output pins on side 1 are enabled when the EN pin is high or open. The output pins on side 1 are in the high-impedance state when the EN pin is low. In noisy applications, tie the EN pin to VCC1.
4 OUT1 O Channel 1 output
5 OUT2 O Channel 2 output
6 NC — Not connected
7
8 GND1 — Ground connection for VCC1
9 FGND2 — Field-side ground, channel 2
10 IN2 I Field-side current input, channel 2
11 SENSE2 I Field-side voltage sense, channel 2
12 SUB2 — Internal connection to input chip 2 substrate. Leave this pin unconnected on the board.
13 SUB1 — Internal connection to input chip 1 substrate. Leave this pin unconnected on the board.
14 FGND1 — Field-side ground, channel 1
15 IN1 I Field-side current input, channel 1
16 SENSE1 I Field-side voltage sense, channel 1