ZHCSGP4C August   2017  – May 2019 INA1650-Q1 , INA1651-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     简化内部原理图
  3. 3 说明
    1.     CMRR 直方图（5746 通道）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: INA1650-Q1
    2.     Pin Functions: INA1651-Q1
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics:
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Audio Signal Path
      2. 7.3.2 Supply Divider
      3. 7.3.3 EMI Rejection
      4. 7.3.4 Electrical Overstress
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single-Supply Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Common-Mode Range
      2. 8.1.2 Common-Mode Input Impedance
      3. 8.1.3 Start-Up Time in Single-Supply Applications
      4. 8.1.4 Input AC Coupling
      5. 8.1.5 Supply Divider Capacitive Loading
    2. 8.2 Typical Applications
      1. 8.2.1 Line Receiver for Differential Audio Signals in a Split-Supply System
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Two-Channel Microphone Input for Automotive Infotainment Systems
      3. 8.2.3 TRS Audio Interface in Single-Supply Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 TINA-TI（免费软件下载）
        2. 11.1.1.2 TI 高精度设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) INA1650-Q1 INA1651-Q1 UNIT
PW (TSSOP) PW (TSSOP)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 97.0 99.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22.6 29.9 °C/W
RθJB Junction-to-board thermal resistance 40.4 42.6 °C/W
ψJT Junction-to-top characterization parameter 0.9 1.5 °C/W
ψJB Junction-to-board characterization parameter 39.6 42.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.