ZHCSDI9D January   2015  – January 2017 HD3SS460

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 High Speed Port Performance Parameters
    7. 7.7 High Speed Signal Path Switching Characteristics
    8. 7.8 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Speed Differential Signal Switching
      2. 8.3.2 Low Speed SBU Signal Switching
      3. 8.3.3 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device High Speed Switch Control Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 USB SS and DP as Alternate Mode
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Critical Routing
      2. 11.1.2 General Routing/Placement Rules
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNH|30
  • RHR|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Power Supply Recommendations

There is no power supply sequence required for HD3SS460. However it is recommended that EN is asserted low after device supply VCC is stable and within specification. It is also recommended that ample decoupling capacitors are placed at the device VCC near the pin.