ZHCSJU2H May   2008  – May 2019 DS90LV028AQ-Q1

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      功能图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Performance Curves
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Power Decoupling Recommendations
        2. 9.2.1.2 Termination
        3. 9.2.1.3 Input Failsafe Biasing
        4. 9.2.1.4 Probing LVDS Transmission Lines
        5. 9.2.1.5 Cables and Connectors, General Comments
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Differential Traces
      2. 10.1.2 PC Board Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from G Revision (November 2018) to H Revision

  • Deleted the Thermal Pad from the DQF packageGo
  • Changed VCC 0.3 To: VCC + 0.3 in the Absolute Maximum Ratings tableGo
  • Added NOTE: "These parameters are specified by design."Go

Changes from F Revision (August 2018) to G Revision

  • Changed the Pin image views Go
  • Changed the Pin Descriptions format Go

Changes from E Revision (April 2013) to F Revision

  • 添加了应用 列表、器件信息 表、ESD 额定值 表、器件功能模式、应用和实施 部分、布局 部分、器件和文档支持 部分。Go
  • Added the DQF package to the data sheet Go

Changes from D Revision (April 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo