SNLS244H September 2006 – January 2016 DS42MB100
PRODUCTION DATA.
The supply (VCC) and ground (GND) pins should be connected to power planes routed on adjacent layers of the printed circuit board. The layer thickness of the dielectric should be minimized so that the VCC and GND planes create a low inductance supply with distributed capacitance. Careful attention to supply bypassing through the proper use of bypass capacitors is required. A 0.01-μF or 0.1-μF bypass capacitor should be connected to each VCC pin such that the capacitor is placed as close as possible to the VCC pins. Smaller body size capacitors, such as 0402 body size, can help facilitate proper component placement. Refer to the VCC pin connections in Figure 11 for further details.