ZHCSCZ2A July   2014  – September 2014 DS125BR820

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics — Serial Management Bus Interface
    7. 6.7 Timing Requirements Serial Bus Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Datapath Blocks
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Control Mode:
      2. 7.4.2 Slave SMBus Mode:
      3. 7.4.3 SMBus Master Mode
    5. 7.5 Signal Conditioning Settings
    6. 7.6 Programming
      1. 7.6.1 EEPROM Register Map for Single Device
    7. 7.7 Register Maps
      1. 7.7.1 Transfer Of Data Via The SMBus
      2. 7.7.2 SMBus Transactions
      3. 7.7.3 Writing a Register
      4. 7.7.4 Reading a Register
      5. 7.7.5 Detailed Register Map
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Signal Integrity in 40G-CR4/KR4/SAS/SATA/PCIe Applications
      2. 8.1.2 Signal Integrity in 40G-SR4/LR4 Applications
      3. 8.1.3 Rx Detect Functionality in 40G-CR4/KR4/SAS/SATA Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Generic High Speed Repeater
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Front Port Applications (40G-CR4/SR4/LR4)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Performance Plots
      3. 8.2.3 PCIe Board Applications (PCIe Gen-3)
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Design Procedure
        3. 8.2.3.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from * Revision (July 2014) to A Revision

  • Added 完整版文档发布Go