ZHCSQL7F May   2010  – May 2022 DRV8312 , DRV8332

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Ratings
    6. 6.6 Power Deratings (DRV8312)
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Error Reporting
      2. 7.3.2 Device Protection System
        1. 7.3.2.1 Bootstrap Capacitor Undervoltage Protection
          1. 7.3.2.1.1 Overcurrent (OC) Protection
        2. 7.3.2.2 Overtemperature Protection
        3. 7.3.2.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
        4. 7.3.2.4 Device Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Different Operational Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Three-Phase Operation
        1. 8.2.1.1 设计要求
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Motor Voltage
          2. 8.2.1.2.2 Current Requirement of 12 V Power Supply
          3. 8.2.1.2.3 Voltage of Decoupling Capacitor
          4. 8.2.1.2.4 Overcurrent Threshold
          5. 8.2.1.2.5 Sense Resistor
          6. 8.2.1.2.6 Output Inductor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DRV8312 Application Diagram for Three-Phase Operation
      3. 8.2.3 Control Signal Logic With Conventional 6 PWM Input Scheme
      4. 8.2.4 Hall Sensor Control With 6 Steps Trapezoidal Scheme
      5. 8.2.5 Sensorless Control With 6 Steps Trapezoidal Scheme
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 System Power-Up and Power-Down Sequence
      1. 9.2.1 Powering Up
      2. 9.2.2 Powering Down
    3. 9.3 System Design Recommendations
      1. 9.3.1 VREG Pin
      2. 9.3.2 VDD Pin
      3. 9.3.3 OTW Pin
      4. 9.3.4 FAULT Pin
      5. 9.3.5 OC_ADJ Pin
      6. 9.3.6 PWM_X and RESET_X Pins
      7. 9.3.7 Mode Select Pins
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material Recommendation
      2. 10.1.2 Ground Plane
      3. 10.1.3 Decoupling Capacitor
      4. 10.1.4 AGND
    2. 10.2 Layout Example
      1. 10.2.1 Current Shunt Resistor
        1. 10.2.1.1 66
    3. 10.3 Thermal Considerations
      1. 10.3.1 Thermal Via Design Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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11.3 静电放电警告

GUID-E1FAB4ED-71A6-4709-A050-639163E0B6D8-low.jpg 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。