ZHCSEF4G December   2014  – March 2017 DRV5023-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Load Dump Protection
        3. 7.3.5.3 Reverse Supply Protection
        4. 7.3.5.4 Output Jitter Characteristic
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from F Revision (September 2016) to G Revision

  • Added the output jitter parameter to the Switching Characteristics tableGo
  • Added the Output Jitter Characteristic sectionGo

Changes from E Revision (August 2016) to F Revision

Changes from D Revision (May 2016) to E Revision

  • Clarified the output description for the FI device version in the Device Output section Go
  • Added the Layout section Go
  • Added 接收文档更新通知 部分Go

Changes from C Revision (February 2016) to D Revision

  • Revised preliminary limits for the FA versionGo

Changes from B Revision (December 2015) to C Revision

  • Added FA 和 FI 器件选项Go
  • Added the typical bandwidth value to the Magnetic Characteristics table Go

Changes from A Revision (May 2015) to B Revision

  • 已更正 SOT-23 封装体尺寸并将 SIP 封装名称更正为 TO-92 Go
  • Added BMAX to Absolute Maximum Ratings Go
  • Removed table notes regarding testing for the operating junction temperature in Absolute Maximum Ratings Go
  • 已更新封装卷带选项 M 和空白Go
  • 已添加 社区资源 Go

Changes from * Revision (December 2014) to A Revision

  • 已将器件状态更新为量产数据 Go