ZHCSQB5C April   2019  – December 2024 DLP480RE

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Capacitance at Recommended Operating Conditions
    8. 5.8  Timing Requirements
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Optical Interface and System Image Quality
        1. 6.5.1.1 Numerical Aperture and Stray Light Control
        2. 6.5.1.2 Pupil Match
        3. 6.5.1.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 DMD Die Temperature Sensing
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Layers
      2. 9.2.2 Impedance Requirements
      3. 9.2.3 Trace Width, Spacing
        1. 9.2.3.1 Voltage Signals
  11. 10Device and Documentation Support
    1. 10.1 第三方产品免责声明
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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5.10 Micromirror Array Physical Characteristics

Table 5-2 Micromirror Array Physical Characteristics
PARAMETER DESCRIPTIONVALUEUNIT
Number of active columns (1)M1920micromirrors
Number of active rows (1)N1200micromirrors
Micromirror (pixel) pitch (1)P5.4µm
Micromirror active array width (1)Micromirror Pitch × number of active columns10.368mm
Micromirror active array height (1)Micromirror Pitch × number of active rows6.48mm
Micromirror active border (Top / Bottom) (2)Pond of micromirrors (POM)20micromirrors/side
Micromirror active border (Right / Left) (2)Pond of micromirrors (POM)84micromirrors/side
(1) See Figure 5-8.
(2) The structure and qualities of the border around the active array includes a band of partially functional micromirrors referred to as the Pond Of Mirrors (POM). These micromirrors are structurally and electrically prevented from tilting toward the bright or ON state but still require an electrical bias to tilt toward the OFF state.
DLP480RE Micromirror Array Physical CharacteristicsFigure 5-8 Micromirror Array Physical Characteristics