ZHCSO64C September   2020  – January 2025 DLP471TE

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  Storage Conditions
   3. 5.3  ESD Ratings
   4. 5.4  Recommended Operating Conditions
   5. 5.5  Thermal Information
   6. 5.6  Electrical Characteristics
   7. 5.7  Switching Characteristics
   8. 5.8  Timing Requirements
   9. 5.9  System Mounting Interface Loads
   10. 5.10 Micromirror Array Physical Characteristics
   11. 5.11 Micromirror Array Optical Characteristics
   12. 5.12 Window Characteristics
   13. 5.13 Chipset Component Usage Specification
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
   4. 6.4 Device Functional Modes
   5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
   6. 6.6 Micromirror Array Temperature Calculation
   7. 6.7 Micromirror Power Density Calculation
   8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
   3. 7.3 Temperature Sensor Diode
9. 8 Power Supply Recommendations
   1. 8.1 DMD Power Supply Power-Up Procedure
   2. 8.2 DMD Power Supply Power-Down Procedure
10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Impedance Requirements
    3. 9.3 Layers
    4. 9.4 Trace Width, Spacing
    5. 9.5 Power
    6. 9.6 Trace Length Matching Recommendations
11. 10Device and Documentation Support
    1. 10.1 第三方产品免责声明
    2. 10.2 Device Support
       1. 10.2.1 Device Nomenclature
       2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
       1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 术语表
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
       1. 12.1.1 Packaging Information