SLVSKK1 December   2025 DLP3944-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Switching Characteristics
    9. 5.8  Timing Requirements
    10.     16
    11. 5.9  System Mounting Interface Loads
    12.     18
    13. 5.10 Micromirror Array Physical Characteristics
    14.     20
    15. 5.11 Micromirror Array Optical Characteristics
    16. 5.12 Window Characteristics
    17. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 SubLVDS Data Interface
      2. 6.3.2 Low Speed Interface for Control
      3. 6.3.3 Power Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
      1. 6.6.1 Monitoring Array Temperature Using the Temperature Sense Diode
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application Overview
      2. 7.2.2 Reference Design
      3. 7.2.3 Application Mission Profile Consideration
      4. 7.2.4 Design Requirements
      5. 7.2.5 Detailed Design Procedure
    3. 7.3 Temperature Sensing
      1. 7.3.1 Temperature Sensing Diode
        1. 7.3.1.1 Temperature Sense Diode Theory
  9. Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
    3. 8.3 DMD Power Supply Sequencing Requirements
  10. Layout
    1. 9.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • FSC|154
散热焊盘机械数据 (封装 | 引脚)
订购信息

Timing Requirements

Over operating free-air temperature range (unless otherwise noted)
MINNOMMAXUNIT
LVCMOS
LPSDR
trRise slew rate (2)(20% to 80%) × VDD(6)0.25V/ns
tfFall slew rate (2)(80% to 20%) × VDD(6)0.25V/ns
trRise slew rate (1)(30% to 80%) × VDD(6)13V/ns
tfFall slew rate (1)(70% to 20%) × VDD(6)13V/ns
tW(H)Pulse duration LS_CLK high50% to 50% reference points(5)4.2ns
tW(L)Pulse duration LS_CLK low50% to 50% reference points(5)4.2ns
tsuSetup timeLS_WDATA valid before LS_CLK(5)1.5ns
thHold timeLS_WDATA valid after LS_CLK(5)1.5ns
SubLVDS
trRise slew rate20% to 80% reference points(7)0.71V/ns
tfFall slew rate80% to 20% reference points(7)0.71V/ns
tW(H)Pulse duration DCLK high50% to 50% reference points(8)0.7ns
tW(L)Pulse duration DCLK low50% to 50% reference points(8)0.7ns
tWINDOWWindow time (1)(3)Setup time + Hold time(5)0.25ns
tsuSetup timeHS_DATA valid before HS_CLK(8)0.17ns
thHold timeHS_DATA valid after HS_CLK(8)0.17ns
tPOWERPower-up receiver(4)200ns
The specification is for DMD_DEN_ARSTZ pin. Refer to LPSDR input rise and fall slew rate in Figure 5-3.
The specification is for LS_CLK and LS_WDATA pins. Refer to LPSDR input rise and fall slew rate in Figure 5-3.
Window time derating example: 0.5V/ns slew rate increases the window time by 0.7ns, from 3ns to 3.7ns. See Figure 5-5.
The specification is for the SubLVDS receiver time only and does not take into account commanding and latency after commanding.
See Figure 5-2.
See Figure 5-3.
See Figure 5-4.
See Figure 5-6.