ZHCSJL8A April   2019  – September 2019 DLP3034-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      DLPDLP3034-Q1 系统框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 Micromirror Array Temperature Calculation
    6. 7.6 Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
    4. 8.4 Illumination Mission Profile Considerations
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
    3. 10.3 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 器件处理
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5 Micromirror Array Temperature Calculation

Active array temperature can be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load.

Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in Figure 17) is provided by the following equations.

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY-TO-CERAMIC)
Equation 2. QARRAY = QELECTRICAL+ ( QINCIDENT × DMD Absorption Constant)

where

  • TARRAY = computed DMD array temperature (°C)
  • TCERAMIC = measured ceramic temperature (TP1 location in Figure 17) (°C)
  • RARRAY-TO-CERAMIC = DMD package thermal resistance from array to TP1 (°C/watt) (see Thermal Information)
  • QARRAY = total power, electrical plus absorbed, on the DMD array (watts)
  • QELECTRICAL = nominal electrical power dissipation by the DMD (watts)
  • QINCIDENT = incident optical power to DMD (watts)
  • DMD Absorption Constant = 0.42

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies.

Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.

Equations shown previous are valid for a 1-chip DMD system with illumination distribution of 83.7% on the active array and 16.3% on the array border.

Sample calculation:

  • QELECTRICAL = 0.105 W
  • TCERAMIC = 55°C
  • QINCIDENT = 3 W
    • Equation 3. QARRAY = 0.105 W + (3 W × 0.42) = 1.37 W
    Equation 4. TARRAY = 55°C + (1.37 W × 2.5°C/W) = 58.4°C

DLP3034-Q1 thermocouple_locations.gifFigure 17. Thermocouple Locations