ZHCSNK3 July   2021 DLP301S

ADVANCE INFORMATION  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Device Nomenclature
      2. 5.1.2 Device Markings
    2. 5.2 接收文档更新通知
    3. 5.3 Related Links
    4. 5.4 支持资源
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 术语表
  6. 6Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • FQS|99
散热焊盘机械数据 (封装 | 引脚)
订购信息

Trademarks

TI E2E™ is a trademark of Texas Instruments.

DLP is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.