SBVS073K November   2006  – May 2026 DCH010505D , DCH010505S , DCH010512D , DCH010512S , DCH010515D , DCH010515S

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Tables
  6. 5 Pin Functions and Configuration
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Repeated High-Voltage Isolation Testing
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Isolation
        1. 7.3.1.1 Operation or Functional Isolation
        2. 7.3.1.2 Basic or Enhanced Isolation
        3. 7.3.1.3 Continuous Voltage
        4. 7.3.1.4 Isolation Voltage
        5. 7.3.1.5 Repeated High-Voltage Isolation Testing
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Optional Input and Output Filters
        1. 8.1.1.1 Input and Output Capacitors
        2. 8.1.1.2 π Filters
      2. 8.1.2 Start-Up
      3. 8.1.3 Connecting the DCH01 in Series
      4. 8.1.4 Connecting the DCH01 in Parallel
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

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6.4 Thermal Information

THERMAL METRIC(1)DCH01 SERIESUNIT
EDJ
(SIP-SINGLE)		EDJ
(SIP-DUAL)
7 PINS7 PINS
RθJAJunction-to-ambient thermal resistance6666°C/W
ψJTJunction-to-top characterization parameter33°C/W
ψJBJunction-to-board characterization parameter6666°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.