SLASFN4 December   2025 DAC60516W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements - I2C Standard Mode
    7. 5.7  Timing Requirements - I2C Fast Mode
    8. 5.8  Timing Requirements - I2C Fast Mode Plus
    9. 5.9  Timing Requirements - SPI
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 6.3.1.1 DAC Register Structure
          1. 6.3.1.1.1 DAC Synchronous Operation
          2. 6.3.1.1.2 DAC Buffer Amplifier
          3. 6.3.1.1.3 DAC Transfer Function
      2. 6.3.2 Internal Reference
      3. 6.3.3 Power-On Reset (POR)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Clear Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 I2C Bus Overview
        2. 6.5.1.2 I2C Bus Definitions
        3. 6.5.1.3 I2C Target Address Selection
        4. 6.5.1.4 I2C Read and Write Operations
        5. 6.5.1.5 I2C General-Call Reset
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SPI Bus Overview
  8. 7 Register Map
    1. 7.1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Voltage Output
    2. 8.2 Typical Application
      1. 8.2.1 Programmable High-Current Voltage Output Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBH|34
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Device Functional Modes